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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,324 edits
Line 200: Line 200:
|BHF etch rate [Å/min]
|BHF etch rate [Å/min]
|-  
|-  
|MFSiNLS2
|~422 (''bghe Feb 2016'')
|~?
|?
|~6 (''bghe Feb 2016'')
|~2.1 (''bghe Feb 2016'')
|~?
|-
|MFSiNLS
|MFSiNLS
|~107
|~107
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