Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

From LabAdviser
← Older edit
VisualWikitext
Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,073 edits
No edit summary
Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,073 edits
No edit summary
 
(37 intermediate revisions by 4 users not shown)
Line 1: Line 1:
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
'''Feedback to this page''': '''[mailto:fabricationsupport@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->


[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
== Die bonder (eutectic metal soldering) ==
== Die bonder (eutectic metal soldering) ==


The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''
 
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
 
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
<!-- remember to remove the type of documents that are not present -->
<!-- remember to remove the type of documents that are not present -->
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Die-bonder Cammax EDB-80]]


<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]


== Process information ==
== Process information ==


*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
 
<br/>
== Flip-chip bonder (glue attachment) ==
<br/>
 
<br/>
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Flip-chip bonder (No it is not the correct picture. new picture coming soon)]]
<br/>
 
<br/>
<!-- give the link to the equipment info page in LabManager: -->
<br/>
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Flip-chip Bonder in LabManager (not there yet)]
<br/>
<br/>


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
Line 31: Line 36:
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Flip-chip bonder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
Line 38: Line 42:
*Fine placement of dies
*Fine placement of dies
*Eutectic metal soldering
*Eutectic metal soldering
|style="background:WhiteSmoke; color:black"|
*Fine placement of dies
*glue attachment
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
Line 47: Line 48:
*Low thermal resistance
*Low thermal resistance
*Always conducting
*Always conducting
|style="background:WhiteSmoke; color:black"|
*Medium or High thermal resistance
*Possibility of both conducting and isolating adhesives
*If an epoxy based adhesive is used the user is required to have the epoxy course.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
Line 57: Line 54:
*Should be able to withstand the soldering temperature
*Should be able to withstand the soldering temperature
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
|style="background:WhiteSmoke; color:black"|
*Any that is compatible with the glue used
|-  
|-  
|}
|}


<br clear="all" />
<br clear="all" />

Latest revision as of 14:59, 6 March 2023

Feedback to this page: click here

The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.
Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

Will be temporary taken out of service during the PolyFabLab construction.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information









Equipment performance and process related parameters

Equipment Die bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
Performance
  • Low thermal resistance
  • Always conducting
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder&oldid=45146"