Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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'''Feedback to this page''': '''[mailto: | '''Feedback to this page''': '''[mailto:fabricationsupport@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]''' | ||
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[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]] | |||
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]] | |||
== Die bonder (eutectic metal soldering) == | == Die bonder (eutectic metal soldering) == | ||
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | ||
'''The | [[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | ||
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier. | |||
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:''' | |||
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[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager] | ||
== Process information == | == Process information == | ||
*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | *[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | ||
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==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b> | |style="background:WhiteSmoke; color:black"|<b>Die bonder</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Fine placement of dies | *Fine placement of dies | ||
*Eutectic metal soldering | *Eutectic metal soldering | ||
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!style="background:silver; color:black;" align="center" width="60"|Performance | !style="background:silver; color:black;" align="center" width="60"|Performance | ||
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*Low thermal resistance | *Low thermal resistance | ||
*Always conducting | *Always conducting | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
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*Should be able to withstand the soldering temperature | *Should be able to withstand the soldering temperature | ||
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | *Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | ||
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Latest revision as of 14:59, 6 March 2023
Feedback to this page: click here
Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
Will be temporary taken out of service during the PolyFabLab construction.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The user manuals, user APVs, technical information and contact information can be found in LabManager:
Process information
Equipment | Die bonder | |
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Purpose |
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Performance |
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Substrates | Allowed materials |
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