Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions

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'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Chrominum_Etch click here]'''
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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
 
'''All measurements on this page has been made by Nanolab staff.'''
 
[[Category: Equipment|Etch Wet Chromium]]
[[Category: Etch (Wet) bath|Chromium]]


==Wet etching of Chromium==
==Wet etching of Chromium==
[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]]
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.]]
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].


# HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate  - 90ml:1200ml:15g - standard at Danchip
We use the following solution to etch chromium:
# Commercial chromium etch


Etch rate are depending on the level of oxidation of the metal.
# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]


====How to mix the Chromium etch 1:====
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
#Take a beaker and add 15g of cerisulphate.
#Add a little water while stirring - make sure all lumps are gone.
#Add water until 600 ml - keep stirring (use magnetic stirring)
#Add 90 ml HNO<sub>3</sub>
#When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.


Normally the etch is reused, but if you need to dispose it, collect it in a bottle marked O waste.


<br clear="all" />
===Overview of the chromium etch process===
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-


===Overview of the data for the chromium etches===
|-
{| border="1" cellspacing="0" cellpadding="4"  
|-style="background:silver; color:black"
!  
!
! Chromium etch 1
! Chromium etch 1
! Chromium etch 2
|-  
|-  
| '''General description'''
 
|
|-style="background:WhiteSmoke; color:black"
Etch of chromium
!General description
|
|
Etch of chromium
Etch of chromium
|-
|-
| '''Link to APV/KBA'''
 
|
|-style="background:LightGrey; color:black"
[http://labmanager.danchip.dtu.dk/d4Show.php?id=1389&mach=18 see APV here]  
!Link to safety APV and KBA
|
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].
[http://labmanager.danchip.dtu.dk/d4Show.php?id=1389&mach=18 see APV here]  
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|-
|-
| '''Chemical solution'''
 
|HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate  - 90ml:1200ml:15g
|-style="background:WhiteSmoke; color:black"
|.
!Chemical solution
|Chrome Etch 18
|-
|-
| '''Process temperature'''
 
|-style="background:LightGrey; color:black"
!Process temperature
|Room temperature
|Room temperature


|.
|-


|-style="background:WhiteSmoke; color:black"
!Possible masking materials
|Photoresist (1.5 µm AZ5214E)
|-
|-


| '''Possible masking materials'''
|-style="background:LightGrey; color:black"
|
!Etch rate
Photoresist (1.5 µm AZ5214E)
|~ 150 nm/min at 22°C
|
.
|-
|-
|'''Etch rate'''
 
|
|-style="background:WhiteSmoke; color:black"
~40-100 nm/min
!Batch size
|
|1-7 4" wafers at a time
.
|-
|-
|'''Batch size'''
 
|
|-style="background:LightGrey; color:black"
1-25 wafers at a time
!Size of substrate
|
|Any size and number that can go inside the beaker in use 
.
|-
|-
|'''Size of substrate'''
 
|
|-style="background:WhiteSmoke; color:black"
4" wafers
!Allowed materials
|
|No restrictions.  
.
Make a note on the beaker of which materials have been processed.
|-
|'''Allowed materials'''
|
No restrictions.
Make a note on the bottle of which materials have been processed.
|
.
|-
|-
|}
|}

Latest revision as of 13:32, 17 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV requires login.

All measurements on this page has been made by Nanolab staff.

Wet etching of Chromium

Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.

Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. You can see the APV here.

We use the following solution to etch chromium:

  1. Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login) here

The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.

Normally the etch is reused, but if you need to dispose it, collect it in a bottle marked O waste.

Overview of the chromium etch process

Chromium etch 1
General description

Etch of chromium

Link to safety APV and KBA see fumehood APV/manual here.

see Chrome Etch 18 KBA here

Chemical solution Chrome Etch 18
Process temperature Room temperature
Possible masking materials Photoresist (1.5 µm AZ5214E)
Etch rate ~ 150 nm/min at 22°C
Batch size 1-7 4" wafers at a time
Size of substrate Any size and number that can go inside the beaker in use
Allowed materials No restrictions.

Make a note on the beaker of which materials have been processed.

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