Specific Process Knowledge/Etch/Etching of Aluminium: Difference between revisions
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==Etching of Aluminium== | ==Etching of Aluminium== | ||
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<br clear="all" /> | <br clear="all" /> | ||
==Comparison | ==Comparison of Aluminium Etch Methods== | ||
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! | ! | ||
![[Specific Process Knowledge/Etch/Wet Aluminium Etch| | ![[Specific Process Knowledge/Etch/Wet Aluminium Etch|Aluminium Etch]] | ||
![[ | ![[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer TMAH manual]] | ||
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher| | ![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ||
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300| | ![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ||
|- | |- | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
|Wet etch of | |Wet etch of Al | ||
|Wet etch | |Wet etch/removal: TMAH<br> | ||
Mainly used for removing Al on e-beam resist after e-beam exposure, see process flow [[Specific_Process_Knowledge/Lithography/EBeamLithography#Aluminum_coating| here]] | |||
|Dry plasma etch of Al | |Dry plasma etch of Al | ||
|Sputtering of Al - pure physical etch | |Sputtering of Al - pure physical etch. | ||
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!Etch rate range | !Etch rate range | ||
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*~100nm/min | *~60-100nm/min | ||
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*~ | *~30nm/min (pure Al) | ||
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*~350 nm/min (depending on features size and etch load) | *~350 nm/min (depending on features size and etch load) | ||
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!Substrate size | !Substrate size | ||
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* | *100 mm wafers (in bath) | ||
*150 mm wafers (in bath) | |||
*Any size (in beaker) | |||
| | | | ||
* | *Chips (6-60 mm) | ||
*100 mm wafers | |||
*150 mm wafers | |||
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*smaller pieces on a carrier wafer | *smaller pieces on a carrier wafer | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!'''Allowed materials''' | !'''Allowed materials''' | ||
|In 'Aluminium Etch' bath: | |||
*See Cross Contamination Sheet for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Aluminium Etch] bath (require login) | |||
In beaker: | |||
*Any material | |||
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* | *Every thing that is allowed in the Developer: TMAH Manual | ||
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*Silicon | *Silicon | ||
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*Titanium | *Titanium | ||
*Chromium | *Chromium | ||
| | |||
*Silicon | |||
*Silicon oxides | |||
*Silicon nitrides | |||
*Metals from the +list | |||
*Metals from the -list | |||
*Alloys from the above list | |||
*Stainless steel | |||
*Glass | |||
*III-V materials | |||
*Resists | |||
*Polymers | |||
*Capton tape | |||
|- | |- | ||
|} | |} | ||