Specific Process Knowledge/Lithography: Difference between revisions

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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


[[Category: Equipment|Lithography]]
[[Category: Lithography]]


'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/Specific_Process_Knowledge/Lithography click here]'''
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->


== Comparing Lithography methodes at Danchip ==
__TOC__


There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.
There are four different types of lithography available at DTU Nanolab:
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
<br clear="all" />
=Comparing lithography methods at DTU Nanolab=


*[[/Deposition of silicon nitride using LPCVD|Process description using methode 1]]
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
<!-- Link to the process info page in LabAdviser -->
 
*[[/Deposition of silicon nitride using LPCVD|Process description using methode 2]]
<!-- Link to the process info page in LabAvdiser -->
 
==Comparison methode 1 and methode 2 for the process==
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-


|-
|-
|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!width="10%"|
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Photolithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|DUV Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]  
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
!width="16%"| [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithography]]
!width="16%"| [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]  
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon polymerization Lithography]]
|-


|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Generel description - methode 1
|Pattern transfer via ultraviolet (UV) light
|Generel description - methode 2
|Pattern transfer via deep ultraviolet (DUV) light
|3
|Patterning by electron beam
|4
|Pattern transfer via hot embossing (HE)
|5
|-
|-


|-
|-
Line 46: Line 45:
!Pattern size range
!Pattern size range
|
|
*~1µm and up
~0.6 µm and up<br>
|
(resist type, thickness, and pattern dependent)
*~200nm and up
|
|
*~10nm and up
~200 nm and up<br>
(pattern type, shape and pitch dependent)
|
|
*~20nm and up
~12 nm - 1 µm<br>
(and larger at high currents)
|
|
*3D ?nm
~20 nm and up
|-
|-


Line 61: Line 61:
!Resist type
!Resist type
|
|
*UV sensitive:
UV sensitive:
**AZ
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
**SU8
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|
*DUV sensitive
**fff
|
|
*E-beam sensitive
DUV sensitive
**ZEP502A
*JSR KRF M230Y, JSR KRF M35G (positive)
**SU8
*UVN2300-0.8 (negative)
|
|
*Imprint polymers:
E-beam sensitive
**??
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|
|
*?? sensitive:
Imprint polymers:
**??
*Topas
*PMMA
*mr-I 7030R
|-
|-
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Resist thickness range
!Resist thickness range
|
|
*~0.5µm to 20µm?
~0.5 µm to 200 µm
|
*~50nm to 2µm?
|
|
*~20nm to 1µm?
~50 nm to 2 µm
|
|
*~20nm to 10µm?
~30 nm to 1 µm
|
|
*?nm - ?µm
~ 100 nm to 2 µm
|-
|-


Line 97: Line 96:
!Typical exposure time
!Typical exposure time
|
|
2s-30s pr. wafer
10 s - 3 min pr. wafer using mask aligners<br>
10 min - 5 hours pr. wafer using maskless aligners
|
|
?-? pr. ?
Process dependent:
*Pattern
*Pattern area
*Dose
 
Throughput is up to 60 wafers/hour
|
|
?-? pr. µm2
Process dependent:
*Dose, Q [µC/cm<sup>2</sup>]
*Beam current, I [A]
*Pattern area, a [cm<sup>2</sup>]
 
time [s] = Q*a/I
|
|
? pr. wafer
Process dependent, including heating/cooling rates
|
? pr. µm2
|-
|-


Line 113: Line 121:
!Substrate size
!Substrate size
|
|
*<nowiki>#</nowiki> small samples
*chips down to 3 mm x 3 mm
*<nowiki>#</nowiki> 50 mm wafers
*50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
*150 mm wafers  
|
*200 mm wafers
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers  
|
|
*<nowiki>#</nowiki> small samples
*100 mm wafers
*<nowiki>#</nowiki> 50 mm wafers
*150 mm wafers  
*<nowiki>#</nowiki> 100 mm wafers
*200 mm wafers
*<nowiki>#</nowiki> 150 mm wafers  
|
|
*<nowiki>#</nowiki> small samples
We have cassettes fitting:
*<nowiki>#</nowiki> 50 mm wafers
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*<nowiki>#</nowiki> 100 mm wafers
*6 wafers of 50 mm in size
*<nowiki>#</nowiki> 150 mm wafers
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size
*1 wafer of 200 mm in size
Only one cassette can be loaded at a time
|
|
*<nowiki>#</nowiki> small samples
*small samples
*<nowiki>#</nowiki> 50 mm wafers
*50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers  
*150 mm wafers
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Allowed materials'''
!'''Allowed materials'''
|
|
*Allowed material 1
Any standard cleanroom material  
*Allowed material 2
|
|
*Allowed material 1
Any standard cleanroom material  
*Allowed material 2
*Allowed material 3
|
|
*Allowed material 1
Any standard cleanroom material, except:
*Allowed material 2
*Materials that will degas
*Allowed material 3
*Graphene requires special treatment 
|
|
*Allowed material 1
Any standard cleanroom material  
*Allowed material 2
|-
*Allowed material 3
|}
|
<br clear="all" />
*Allowed material 1
 
*Allowed material 2
=Equipment Pages=
*Allowed material 3
 
{| style="color: black;" width="90%"
| colspan="3" |
|-
|-
| style="width: 20%"|
'''<big>[[Specific Process Knowledge/Lithography/Resist|Resist]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]]
*[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist|UV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#DUV_Resist|DUV Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]]
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]]
'''<big>[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]</big>'''
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
*[[Specific Process Knowledge/Lithography/Pretreatment#Buffered_HF-Clean|BHF]]
*[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
'''<big>[[Specific Process Knowledge/Lithography/Coaters|Coating]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]]
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]]
'''<big>[[Specific Process Knowledge/Lithography/Baking|Baking]]</big>'''
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]
| style="width: 20%"; valign="top"|
'''<big>[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]</big>'''
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: MA6 - 1|Aligner: MA6 - 1]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6-2]]
<!--*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV-lamp]]-->
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]]
'''<big>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]</big>'''
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]]
'''<big>[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]</big>'''
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]]
'''<big>[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]</big>'''
*[[Specific Process Knowledge/Thin film deposition/MVD|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|Imprinter 01]]
| style="width: 20%"; valign="top"|
'''<big>[[Specific Process Knowledge/Lithography/Development|Development]]</big>'''
*[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]
*[[Specific Process Knowledge/Lithography/Development#Developer:_SU8_(wetbench)|Developer: SU8 (wetbench)]]
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer: E-beam]]
'''<big>[[Specific Process Knowledge/Lithography/Descum|Descum]]</big>'''
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3:Descum]]
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]]
'''<big>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</big>'''
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
'''<big>[[Specific Process Knowledge/Lithography/Strip|Strip]]</big>'''
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma_Asher_3: Descum|Plasma Asher 3: Descum]]
*[[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]
|}
|}
<br clear="all" />
=Lithography Tool Package Training=
DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.
You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).
For details, dates, and course material, please check the course description under [[LabAdviser/Courses#The_Lithography_TPT|Courses]].
'''Signing up for the course'''
The course is in DTU Learn. You sign up for the course by enrolling yourself in the course [https://learn.inside.dtu.dk/d2l/le/discovery/view/course/56077 DTU Nanolab TPT: Lithography] - '''requires login'''
* Watch the lecture videos
* Successfully complete all the quizzes
'''Learning objectives'''
Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:
* Coating
* Exposure
* Development
* Resist, substrates and pre-treatment
* Post-lithography steps
'''After completing the TPT'''
When all TPT quizzes have been completed successfully, you have finished the lithography TPT, and can begin the online training on the lithography equipment you need to use. The online training is available in the course [https://learn.inside.dtu.dk/d2l/le/discovery/view/course/118192 DTU Nanolab: lithography equipment training] - '''requires login'''
After completing the online equipment training, you become eligible for the hands-on authorization training, which will take place inside the cleanroom.
<br clear="all" />
=Knowledge and Information about Lithography=
{| style="color: black;" width="90%"
| colspan="3" |
|-
| style="width: 20%"; valign="top"|
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[http://www.microchemicals.com/support/troubleshooter.html Lithography Troubleshooter from MicroChemicals]
*[http://www.microchemicals.com/downloads/application_notes.html Application Notes from MicroChemicals]
*[http://www.cnf.cornell.edu/cnf_spietoc.html Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]
'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos:
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/watch?v=hMgpRSOokxE&list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)
| style="width: 20%"; valign="top"|
<!-- Removed by TARAN 2024-09-27
'''<big>Lithography TPT lecture slides</big>'''<br>
''' NB: Access to slides require login'''
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->
'''<big>Training videos</big>'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
*[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
'''Playlists on YouTube:'''
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner training videos]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA&list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Old Lithography TPT training videos]


| style="width: 20%"; valign="top"|
'''<big>Manuals</big>'''<br>
'''NB: Access to manuals require login'''
*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
*Manual Spin Coater: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 Spin Coater: Labspin 02] or [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 Spin Coater: Labspin 03]
*UV Mask Aligner: [http://labmanager.dtu.dk/d4Show.php?id=3822&mach=339 Aligner: MA6 - 2] or [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 KS Aligner]
*Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography]
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]
*Manual E-beam Developer: [http://labmanager.dtu.dk/d4Show.php?id=5070&mach=341 Developer: E-beam Manual]
'''<big>Process Flows</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_flow|E-beam resist process flows]]
*[[:Media:Process_Flow_TPT first print.pdf|Old TPT process flow (first print)]]
*[[:Media:Process_Flow_TPT alignment.pdf|Old TPT process flow (alignment)]]
|}
<br clear="all" />
<br clear="all" />

Latest revision as of 15:50, 13 November 2024

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this page: click here

There are four different types of lithography available at DTU Nanolab:


Comparing lithography methods at DTU Nanolab

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via ultraviolet (UV) light Pattern transfer via deep ultraviolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range

~0.6 µm and up
(resist type, thickness, and pattern dependent)

~200 nm and up
(pattern type, shape and pitch dependent)

~12 nm - 1 µm
(and larger at high currents)

~20 nm and up

Resist type

UV sensitive:

  • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
  • AZ 5214E, AZ nLOF 2020, SU-8 (negative)

DUV sensitive

  • JSR KRF M230Y, JSR KRF M35G (positive)
  • UVN2300-0.8 (negative)

E-beam sensitive

  • AR-P6200 CSAR, ZEP502A , PMMA (positive)
  • HSQ, mr-EBL, AR-N 7520 (negative)

Imprint polymers:

  • Topas
  • PMMA
  • mr-I 7030R
Resist thickness range

~0.5 µm to 200 µm

~50 nm to 2 µm

~30 nm to 1 µm

~ 100 nm to 2 µm

Typical exposure time

10 s - 3 min pr. wafer using mask aligners
10 min - 5 hours pr. wafer using maskless aligners

Process dependent:

  • Pattern
  • Pattern area
  • Dose

Throughput is up to 60 wafers/hour

Process dependent:

  • Dose, Q [µC/cm2]
  • Beam current, I [A]
  • Pattern area, a [cm2]

time [s] = Q*a/I

Process dependent, including heating/cooling rates

Substrate size
  • chips down to 3 mm x 3 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes fitting:

  • 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size
  • 1 wafer of 200 mm in size

Only one cassette can be loaded at a time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

Any standard cleanroom material

Any standard cleanroom material

Any standard cleanroom material, except:

  • Materials that will degas
  • Graphene requires special treatment

Any standard cleanroom material


Equipment Pages

Resist

Pretreatment

Coating

Baking

UV Exposure Tools

Deep-UV Exposure

Electron Beam Exposure

Nano Imprint Lithography


Development

Descum

Lift-off

Strip


Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment. After the TPT has been successfully completed, you can begin training on the lithography equipment at DTU Nanolab.

You are required to pass this course, in order to get access to using the lithography equipment inside the DTU Nanolab fabrication facility (The Cleanroom).

For details, dates, and course material, please check the course description under Courses.


Signing up for the course

The course is in DTU Learn. You sign up for the course by enrolling yourself in the course DTU Nanolab TPT: Lithography - requires login

  • Watch the lecture videos
  • Successfully complete all the quizzes


Learning objectives

Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:

  • Coating
  • Exposure
  • Development
  • Resist, substrates and pre-treatment
  • Post-lithography steps


After completing the TPT

When all TPT quizzes have been completed successfully, you have finished the lithography TPT, and can begin the online training on the lithography equipment you need to use. The online training is available in the course DTU Nanolab: lithography equipment training - requires login

After completing the online equipment training, you become eligible for the hands-on authorization training, which will take place inside the cleanroom.

Knowledge and Information about Lithography

Literature


Lecture videos

  • Lithography TPT lecture videos:
    • Current version (6 videos, 1:28 hours:minutes in total) on YouTube
    • Old version (7 videos, 2:41 hours in total) on YouTube
  • A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)

Training videos

Playlists on YouTube:


Manuals
NB: Access to manuals require login


Process Flows


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