Jump to content

Specific Process Knowledge/Thin film deposition: Difference between revisions

BGE (talk | contribs)
No edit summary
Eves (talk | contribs)
 
(236 intermediate revisions by 19 users not shown)
Line 1: Line 1:
{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
== Choose material to deposit ==
== Choose material to deposit ==


=== Metals ===  
{| {{table}}
*Aluminium
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
*Gold
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
*Titanium
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
*Nickel
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"
 
|style="background: LightGray"|
[[/Deposition of Silicon|Silicon]] <br/>
[[/Deposition of Germanium|Germanium]] <br/>


=== Polymers ===
|style="background: #DCDCDC"|
*SU8
[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
*Antistiction coating
[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>


=== Other materials ===


*PolySilicon
|style="background: LightGray"|
*Silicon Oxide
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
*Silicon Nitride
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
[[/Deposition of Niobium Nitride| Niobium Nitride (NbN)]] - ''superconductors''<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Tungsten Nitride| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Tantalum Nitride| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/>


|style="background: #DCDCDC"|
[[/Deposition of Carbon|Carbon]] <br/>
<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Sputter deposition of metals and alloys|Iron]]<br/>
[[/Deposition of Magnesium|Magnesium]]<br/>
[[/Deposition of Molybdenum|Molybdenum]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Niobium|Niobium]]<br/>
[[/Deposition of Palladium|Palladium]]<br/>
[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Ruthenium|Ruthenium]]<br/>
[[/Deposition of Silver|Silver]]<br/>
[[/Deposition of Tantalum|Tantalum]]<br/>
[[/Deposition of Tin|Tin]]<br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Scandium|Scandium]]<br/>
|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Deposition of NbTi|NbTi]] <br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
[[/Deposition of MoSi|MoSi]] alloy (50%/50% by At.%) <br/>
And an electroceramic:
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]
|style="background: LightGray"|
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
|style="background: #DCDCDC"|
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
Topas <br/>
PMMA
|style="background: LightGray"|
[[/Deposition of CrSi|CrSi bilayer]] <br/>
|-
|}
Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.


== Choose deposition equipment ==
== Choose deposition equipment ==


*Alcatel - ''E-beam evaporator and sputter tool''
 
*Leybold - ''E-beam evaporator and multiple wafer tool''  
{| {{table}}
*Wordentec - ''Metal evaporator and ?''
| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
*PECVD - ''Plasma Enhanced Chemical Vapor deposition''
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
*B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid''
| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
*B3 Furnace LPCVD TEOS - ''Deposition of silicon oxide''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
*B4 Furnace LPCVD PolySilicon - ''Deposition of polysilicon''
| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
*MVD - ''Molecular Vapor Deposition''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''
 
 
 
|-valign="top"
|style="background: LightGray"|
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/thermalevaporator|Thermal evaporator]]
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
 
<!--*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''  
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
 
|style="background: #DCDCDC"|
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
|style="background: LightGray"|
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
|style="background: #DCDCDC"|
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
|style="background: LightGray"|
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
|style="background: #DCDCDC"|
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
|-
|}