Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nanobosch6: Difference between revisions
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== Test run using AZ resist 24/9-2012 == | == Test run using AZ resist 24/9-2012 == | ||
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== Test run using AZ resist 24/9-2012 == | == Test run using AZ resist 24/9-2012 == |
Latest revision as of 15:18, 24 August 2021
Test run using AZ resist 24/9-2012
Substrate information | Wafer | C01296.05 |
---|---|---|
Mask | Travka50 mask in a few microns of AZ resist | |
Date | 24/9-2012 | |
Tool | Pegasus | |
Process | Recipe | nanobosch6 |
Tool conditioning | 3 minute TDESC clean | |
Process duration | 15 minutes | |
Purpose | test | |
Characterisation | SEM Zeiss |
Test run using AZ resist 24/9-2012
Substrate information | Wafer | C01296.09 |
---|---|---|
Mask | Travka80 mask in a few microns of AZ resist | |
Date | 24/9-2012 | |
Tool | Pegasus | |
Process | Recipe | nanobosch6 |
Tool conditioning | 3 minute TDESC clean | |
Process duration | 15 minutes | |
Purpose | test | |
Characterisation | SEM Zeiss |