Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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Details will come by the end of 2012. See LabManager for now.
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
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/Jesper Hanberg
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
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== Polisher/Lapper ==
 
<!-- copyright issue rkc -->
<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
Training is required before using th machine. The machine is equipped with a LabManager lock.-->
 
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
 
'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
 
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=299 The Logitech PM5 Polisher/Lapper in LabManager]
 
==Equipment performance and process related parameters==
 
[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
Thinning of substrates of
|style="background:WhiteSmoke; color:black"|
*InP
*GaAs
*Silicon
*Metals
*Glass/Quartz
<!-- |style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3 -->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"| Thinning
|style="background:WhiteSmoke; color:black"|
*Removal rate: 1-10µm/min
*Thickness accuracy: +/- 10 µm
*Thickness homogeneity: +/- 10 µm
*Roughness: +/- ? µm
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
*Performance range 3 -->
|-
|style="background:LightGrey; color:black"|Polishing
|style="background:WhiteSmoke; color:black"|
*Removal rate: ~1 µm/min
*Thickness accuracy: ? µm
*Thickness homogeneity: ? µm
*Roughness: +/- ? µm
<!-- |style="background:WhiteSmoke; color:black"|
*Performance range -->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
|style="background:LightGrey; color:black"|Polishing liquid
|style="background:WhiteSmoke; color:black"|
*Al2O3 (alumina) powder: 3, 9 or 20 µm
*Chemlox (for polishing)
*SF1 Polishing Fluid (for polishing e.g. SiO2)
|-
|style="background:LightGrey; color:black"|Polishing cloths
|style="background:WhiteSmoke; color:black"|
*Chemcloth Polishing Cloths (for use with SF1 liquid)
|-
|style="background:LightGrey; color:black"|Rotation speed
|style="background:WhiteSmoke; color:black"|
*Thinning: 5-20 rpm
*Polishing: 5-80 rpm
|-
|style="background:LightGrey; color:black"|Arm sweep
|style="background:WhiteSmoke; color:black"|
*Thinning: stationary
*Polishing: 12% (inner) - 80% (outer)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*one 50 mm wafer
*one 100 mm wafer
<!-- |style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers -->
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*InP
*GaAs
*Silicon
*Metals
*Glass/Quartz
<!-- |style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3 -->
|-
|}
[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
 
<br clear="all" />

Latest revision as of 15:24, 28 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links Labmanager requires login.

Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

PM5 lapper in Fume hood
Equipment Polisher/Lapper
Purpose

Thinning of substrates of

  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz
Performance Thinning
  • Removal rate: 1-10µm/min
  • Thickness accuracy: +/- 10 µm
  • Thickness homogeneity: +/- 10 µm
  • Roughness: +/- ? µm
Polishing
  • Removal rate: ~1 µm/min
  • Thickness accuracy: ? µm
  • Thickness homogeneity: ? µm
  • Roughness: +/- ? µm
Process parameter range Polishing liquid
  • Al2O3 (alumina) powder: 3, 9 or 20 µm
  • Chemlox (for polishing)
  • SF1 Polishing Fluid (for polishing e.g. SiO2)
Polishing cloths
  • Chemcloth Polishing Cloths (for use with SF1 liquid)
Rotation speed
  • Thinning: 5-20 rpm
  • Polishing: 5-80 rpm
Arm sweep
  • Thinning: stationary
  • Polishing: 12% (inner) - 80% (outer)
Substrates Batch size
  • # small samples
  • one 50 mm wafer
  • one 100 mm wafer
Allowed materials
  • InP
  • GaAs
  • Silicon
  • Metals
  • Glass/Quartz
lapping jig
mounting/measuring space


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