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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Profiler/Optical_Profiler_(Sensofar)_acceptance_test click here]'''
=<span style="color:#FF0000"> This optical profiler has been decommissioned and replaced by the S Neox system, which is very similar </span> =
=Results from the Optical Profiler (Sensofar) acceptance test=
=Results from the Optical Profiler (Sensofar) acceptance test=


The acceptance test was performed in January 2012 by STInstruments and Sensofar together with  
The acceptance test was performed in January 2012 by ST Instruments and Sensofar together with  
Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.
Pernille V. Larsen@ DTU nanolab and Berit G. Herstrøm @ DTU nanolab.


==This Table shows an overview of the acceptance tests==
==This Table shows an overview of the acceptance tests==
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| align="center" style="background:#f0f0f0;"|'''Acceptance criteria'''
| align="center" style="background:#f0f0f0;"|'''Acceptance criteria'''
|-
|-
| [[#Results_of_acceptance_test_no._1,_2_and_3|1]]||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm
| [[#Results_of_acceptance_test_no._1,_2_and_3|1]]||Patterned flat sample of silicon||Sample material: Patterned silicon substrate <br/> Trench depth with aspect ratio 1:10 on a 10 µm wide trench||Depth 100±2 µm
|-
|-
| ||||Trench depth with aspect ratio 1:10 on a 10 µm wide trench||
| ||||||
|-
|-
| [[#Results_of_acceptance_test_no._1,_2_and_3|2]]||Patterned flat sample of silicon.||Sample material:  Patterned silicon substrate.||Depth 91±2 µm
| [[#Results_of_acceptance_test_no._1,_2_and_3|2]]||Patterned flat sample of silicon.||Sample material:  Patterned silicon substrate <br/> Trench depth with aspect ratio 1:11 on a 8 µm wide trench||Depth 91±2 µm
|-
|-
| ||||Trench depth with aspect ratio 1:11 on a 8 µm wide trench||
| ||||||
|-
|-
| [[#Results_of_acceptance_test_no._1,_2_and_3|3]]||Patterned flat sample of silicon||Sample material: Patterned silicon substrate||Depth 85±2 µm
| [[#Results_of_acceptance_test_no._1,_2_and_3|3]]||Patterned flat sample of silicon||Sample material: Patterned silicon substrate <br/> Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench||Depth 85±2 µm
|-
|-
| ||||Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench||
| ||||||
|-
|-
| [[#Results_of_acceptance_test_no._4|4]]||Patterned flat sample of glass||3D profile of pattern etched down in a quartz sample.||Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1%
| [[#Results_of_acceptance_test_no._4|4]]||Patterned flat sample of glass||3D profile of pattern etched down in a quartz sample. <br/> Pattern size 20 µm x 20 µm, depth 500 nm||Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1%
|-
|-
| ||||Pattern size 20 µm x 20 µm, depth 500 nm||
| ||||||
|-
|-
| [[#Results of acceptance test no. 5|5]]||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement.
| [[#Results of acceptance test no. 5|5]]||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer. <br/> 7 µm deep pattern, trench width 6 µm||Step height must be within ±3% of a SEM profile measurement.
|-
|-
| ||||7 µm deep pattern, trench width 6 µm||
| ||||||
|-
|-
| [[#Results of acceptance test no. 6|6]]||Flat sample of silicon with thick layer of patterned polymer||Sample material: SU8 on silicon. ||Height 69±2 µm
| [[#Results of acceptance test no. 6|6]]||Flat sample of silicon with thick layer of patterned polymer||Sample material: SU8 on silicon. <br/> Pillar heights of 69 µm with 25 µm between pillar edges ||Height 69±2 µm
|-
|-
| ||||Pillar heights of 69 µm with 25 µm between pillar edges||
| ||||||
|-
|-
| [[#Results of acceptance test no. 7|7]]||Free standing structure||Measure bow due to stress of a membrane.||Membrane bow repeatability of 5 successive measurement within 2%
| [[#Results of acceptance test no. 7|7]]||Free standing structure||Measure bow due to stress of a membrane. <br/> Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm) <br/> Membrane size: honey comb structure approximately 150 µm in diameter <br/> Bow < 500 nm ||Membrane bow repeatability of 5 successive measurement within 2%
|-
|-
| ||||Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm).||
| ||||||
|-
|-
| ||||Membrane size: honey comb structure approximately 150 µm in diameter.||
| [[#Results of acceptance test no. 8|8]]||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2%
|-
|-
| ||||Bow < 500 nm||
| ||||||
|-
|-
| [[#Results of acceptance test no. 8|8]]||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2%
| [[#Results of acceptance test no. 9|9]]||Narrow trenches and holes ||Sample material: Patterned silicon substrate <br/> 2.5 µm wide trench in silicon with a depth of 20 µm||Depth 20±2 µm
|-
|-
| [[#Results of acceptance test no. 9|9]]||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm
| ||||||
|-
|-
| ||||2.5 µm wide trench in silicon with a depth of 20 µm||
| [[#Results of acceptance test no. 10|10]]||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm
|-
|-
| [[#Results of acceptance test no. 10|10]]||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm
| ||||||
|-
|-
| [[#Results of acceptance test no. 11|11]]||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement.  
| [[#Results of acceptance test no. 11|11]]||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement.  
|-
|-
| [[#Results of acceptance test no. 12|12]]||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement.
| ||||||
|-
|-
| ||||Measure thickness of AZ-resist on pillars of 50 µm in diameter||
| [[#Results of acceptance test no. 12|12]]||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist <br/> Measure thickness of AZ-resist on pillars of 50 µm in diameter||Within ±1% from a standard profiler measurement.
|-
|-
| [[#Results of acceptance test no. 13|13]]||Roughness repeatability||Sample material: Si wafer with poly-silicon layer.||Repeatability within 0.2%
| ||||||
|-
|-
| ||||3 successive measurements of the roughness ||
| [[#Results of acceptance test no. 13|13]]||Roughness repeatability||Sample material: Si wafer with poly-silicon layer <br/> 3 successive measurements of the roughness ||Repeatability within 0.2%
|-
|-
|}
|}
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Measurement: Trench depth with aspect ratio 1:10, 1:11 and 1:13 on a 10µm, 8mm and 6.4µm wide trenches respectively
Measurement: Trench depth with aspect ratio 1:10, 1:11 and 1:13 on a 10µm, 8mm and 6.4µm wide trenches respectively


Acceptance criteria:Depth 100±2 µm, 91±2µm and 85±2µm. The SEM profile images of the three trenches are shown here:
Acceptance criteria: Depth 100±2 µm, 91±2µm and 85±2µm. The SEM profile images of the three trenches are shown here:


{| border="1" cellspacing="1" cellpadding="2"  
{| border="1" cellspacing="1" cellpadding="2"  
!
!
[[image:Sensofar_A1_SEM.jpg|100x100px|thumb|center|A1]]
[[image:Sensofar_A1_SEM.jpg|200x200px|thumb|center|A1]]
!
!
[[image:Sensofar_A2_SEM.jpg|100x100px|thumb|center|A2]]
[[image:Sensofar_A2_SEM.jpg|200x200px|thumb|center|A2]]
!
!
[[image:Sensofar_A3_SEM.jpg|100x100px|thumb|center|A3]]
[[image:Sensofar_A3_SEM.jpg|200x200px|thumb|center|A3]]
|}
|}


'''Results'''




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====Setting for methode no. 1 for test no. 1,2 and 3: confocal====
====Settings for methode no. 1 for test no. 1, 2 and 3: confocal====
Recipe: Trench
Recipe: Trench
*Operation mode: trench
*Operation mode: trench
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**Dual - bottom up
**Dual - bottom up
***top: 8µm
***top: 8µm
***Gap: 91µm (the trench depth)
***Gap: 91µm (<- choose the trench depth)
***Bottom: 8µm
***Bottom: 8µm
**Speed factor: 1x
**Speed factor: 1x
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*Objective: Interferometric 50x DI
*Objective: Interferometric 50x DI
*Z scan: VSI
*Z scan: VSI
*Light souce: increased gain and contrast
*Light source: increased gain and contrast


==Results of acceptance test no. 4==
==Results of acceptance test no. 4==
Sample material: Patterned fused silica.
Sample material: Patterned flat sample of glass


Measurement: Depth of pattern
Measurement: Depth of pattern


Standard profiler measurement:335nm
Standard profiler measurement:335 nm


Acceptance criteria:Depth within ±1% from a standard profiler measurement (331.65nm-338.35nm) and repeatability (3 successive measurements) within 0.1%  
Acceptance criteria:Depth within ±1% from a standard profiler measurement (331.65nm-338.35nm) and repeatability (3 successive measurements) within 0.1%  
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Treshold: 1%
Treshold: 1%
Average 4 images (to reduce noise)




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| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''Measured depth [nm]'''
| align="center" style="background:#f0f0f0;"|'''Measured depth [nm]'''
| align="center" style="background:#f0f0f0;"|'''Repeated 20170925 with cover off'''
| align="center" style="background:#f0f0f0;"|'''Repeated 20180816 after repair'''
|-
|-
| 1||337.5
| 1||337.5||347.9||341.1
|-
|-
| 2||336.5
| 2||336.5||333.9||340.4
|-
|-
| 3||334.7
| 3||334.7||341.5||337.2
|-
|-
| 4||335.5
| 4||335.5||343.2||330.8
|-
|-
| 5||339.2
| 5||339.2||347.7||339.0
|-
|-
| 6||337.2
| 6||337.2||345.4||340.0
|-
|-
| 7||334.2
| 7||334.2||341.8||338.8
|-
|-
| 8||335.5
| 8||335.5||337.9||339.8
|-
|-
| 9||341.1
| 9||341.1||342.1||334.6
|-
|-
| 10||344.4
| 10||344.4||335.9||336.4
|-
|-
|Average depth||336.58
|Average depth||337.58||341.73||337.82
|-
|-
|Repeatability||3% (the bad repeatability was accepted due to the high noise level in the room)
|Repeatability||3.0% (the bad repeatability was accepted due to the high noise level in the room)||4.1%||3.0%
|}
|}


==Results of acceptance test no. 5==
==Results of acceptance test no. 5==
Sample: Flat sample of silicon with thick patterned oxide.
Sample: Flat sample of silicon with thick patterned oxide (APOX).


Measurement: Step height of patterned thick (10 µm) oxide on top of a silicon wafer.The pattern is aprox. 7µm thick
Measurement: Step height of patterned thick (10 µm) oxide on top of a silicon wafer. The pattern is aprox. 7µm thick.


Acceptance criteria: Step height must be within ±3% of a SEM profile measurement. See the SEM profile here:
Acceptance criteria: Step height must be within ±3% of a SEM profile measurement. See the SEM profile here:
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{| border="1" cellspacing="1" cellpadding="2"  
{| border="1" cellspacing="1" cellpadding="2"  
!
!
[[Image:Sensofar_A5_SEM.jpg|100x100px|thumb|center|A5]]
[[Image:Sensofar_A5_SEM.jpg|200x200px|thumb|center|A5]]
|}
|}


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'''Settings:'''
'''Settings:'''
Two different setting were tried out, the second was the most succesful:
Two different setting were tried out, the second was the most successful:


Setting no. 1:
Setting no. 1:
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{| border="1" cellspacing="1" cellpadding="2"  
{| border="1" cellspacing="1" cellpadding="2"  
!
!
[[image:Sensofar_A9_SEM.jpg|100x100px|thumb|center|SEM profile image of structure]]
[[image:Sensofar_A9_SEM.jpg|200x200px|thumb|center|SEM profile image of structure]]
|}
|}


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Measurement:Film thickness measurement of transparent thin film
Measurement:Film thickness measurement of transparent thin film


Acceptance criteria:SiO2 thickness 28±1 nm  
Acceptance criteria: SiO2 thickness 28±1 nm  




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==Results of acceptance test no. 11==
==Results of acceptance test no. 11==
Sample:120 nm nitride on 110 nm oxide on a silicon substrate
Sample: 120 nm nitride on 110 nm oxide on a silicon substrate


Measurement:Measurements of multiple stacks
Measurement: Measurements of multiple stacks


Acceptance criteria: Within ±2% on each layer from an ellipsometer measurement (SiO2: 112nm, Si3N4: 139nm)
Acceptance criteria: Within ±2% on each layer from an ellipsometer measurement (SiO2: 112nm, Si3N4: 139nm)
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Sample: Si with 1.4 µm patterned AZ-resist on 50µm pillars
Sample: Si with 1.4 µm patterned AZ-resist on 50µm pillars


Measurement:Film thickness measurements of transparent films on small structure
Measurement: Film thickness measurements of transparent films on small structure


Acceptance criteria:Within ±1% from a standard profiler measurement.
Acceptance criteria: Within ±1% from a standard profiler measurement.




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Acceptance criteria: Repeatability within 0.2%
Acceptance criteria: Repeatability within 0.2%


Note: Because the surface roughness of the sample was very low and the noise/vibration level too high we could not obtain the specified repeatibility.
Note: Because the surface roughness of the sample was very low and the noise/vibration level too high we could not obtain the specified repeatability.




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'''Result'''
'''Result'''
*The surface roughness (Ra) was 0.5nm
*The surface roughness (Ra) was 0.5nm
*The repeatebility over 10 measurements was 34%
*The repeatability over 10 measurements was 34%
*The maximum deviation in roughness was 0.2nm
*The maximum deviation in roughness was 0.2nm