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Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

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== Silicon sputter==
{{cc-nanolab}}


Silicon can be deposited in [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec.]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Si_sputter_in_Wordentec click here]'''


'''<p style="color:red;">The Wordentec has been decomissioned in 2025. These results are kept for reference.</p>'''


'''Parameters'''
= Silicon sputtering in the Wordentec=


Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.
Silicon can be sputter deposited in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]] as well as in the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]] (details on sputtering Si in the Sputter-System Lesker [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|here]]) and in the new [[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Cluster Lesker]] (results [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC1)|here]] and [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Metal-Oxide(PC3)|here]]).  




==Parameters==


Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces.
Listed below are tried parameters, that can be used during Si deposition in the Wordentec. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.
 
'''Do not use the power more than 180 W without consulting staff''', since the Si target could break into a lot of small pieces.  


{| border="1" cellspacing="0" cellpadding="4"  
{| border="1" cellspacing="0" cellpadding="4"  
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|-
|-
| Sputter pressure
| Sputter pressure
| 5*10<sup>-2</sup>
| 5*10<sup>-3</sup> mbar
| 5*10<sup>-2</sup>
| 1*10<sup>-2</sup> mbar


|-
|-
| Rate
| Rate
| About 0,6Å/s  
| About 0.7 Å/s  
| About 0,6Å/s  
| About 0.6 Å/s  
|-
|-
|}
|}
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