Specific Process Knowledge: Difference between revisions

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(New page: Choose the process topic you are interested in. 1. Photolithography 2. Thin film deposition 3. Etch 4. Wafer cleaning 5. Thermal Process 6. Polymer 7. [[Pack...)
 
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Choose the process topic you are interested in.
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1. [[Photolithography]]


2. [[Thin film deposition]]
=== Choose the process topic you are interested in: ===
*[[/Pattern Design|Pattern Design and Mask Fabrication]]  


3. [[Etch]]
*[[/Back-end processing|Back-end processing]]


4. [[Wafer cleaning]]
*[[/Bonding|Bonding]]


5. [[Thermal Process]]
*[[/Characterization|Characterization]]


6. [[Polymer]]
*[[/Direct Structure Definition|Direct Structure Definition]]


7. [[Packaging]]
*[[/Doping|Doping]]


8. [[Characterization]]
*[[/Etch|Etch]]


9. [[E-beam lithography]]
*[[/Imprinting|Imprinting]]


10. [[III-V Process]]
*[[/Lithography|Lithography]]
 
*[[/Thermal Process|Thermal Process]]
 
*[[/Thin film deposition|Thin film deposition]]
 
*[[/Wafer and sample drying|Wafer and sample drying]]
 
*[[/Wafer cleaning|Wafer Cleaning]]
 
*[[/Wafer Information|Wafer Information]]
 
*[[/Overview of Fume Hoods|Overview of Fume Hoods]]
 
*[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]]
 
 
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Latest revision as of 14:05, 28 June 2023