Latest revision as of 09:12, 8 September 2025

TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT HB 100 wire bonder: process details

Ball Wire Bonder K&S 4524

The bonder is currently in building 346 Phoenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Equipment	TPT HB100 Wire Bonder	Ball Wire Bonder K&S 4524
Purpose	Al and Au 25µm wire bonding Wedge and ball wire bonding Au ribbon (100x20µm) bonding	Au 25µm wire bonding Ball wire bonding
Performance	Manual operation Wedge bonding: recommended min. bonding area 200 µm x 200 µm Ball bonding: recommended min. bonding area 200 µm x 200 µm recommended temperature 120 ^oC.	Semi-automatic and manual operation Bond placement laser pointer recommended min. bonding area 100 µm x 100 µm recommended temperature 120 ^oC.
Substrates	Should be able to withstand the wire bonding temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)

@@ Line 1: / Line 1: @@
-==TPT Wire Bonder==
+=TPT HB100 Wire Bonder =
+Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
-[[Image:TPTWireBonder.jpg|300x300px|thumb|TPT Wire Bonder, Packlab, Building 347, 2nd floor]]
+'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
-[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
-The TPT Wire Bonder is a new machine bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.
+[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]]
+[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
-Please be aware that the bonder only is operated by Danchip personal.
+=Ball Wire Bonder K&S 4524=
+<!-- copyright issue kabi - replace with actual photo and numbering
+[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
+-->
+[[Image:K-S 4524 wirebonder DTU.jpg|thumb|200px|K&S 4524 ball wire bonder]]
+<span style="background:#FF2800">The bonder is currently in building 346 Phoenex lab.</span>
+The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
+'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
-===Wedge Bonding===
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
-*Gold wire 25 µm wire.
+<br clear=all>
-*Aluminium wire 25 µm wire.
-*Min. bonding area 200 µm.
+=Equipment performance and process related parameters=
-===Ball Bonding===
+[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]
-Ball bonding gives free choice of  bonding direction. First bond forms a small ball and second bond is a wedge bond.
+<br clear=all>
-*Gold only 25 µm wire.
+{| border="2" cellspacing="0" cellpadding="2"
-*Min. bonding pad 300 µm.
-*Sample withstand heating to 120 <sup>o</sup>C.
+!border="none" style="background:silver; color:black;" align="center"|Equipment
+|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
+|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder K&S 4524</b>
+|-
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:WhiteSmoke; color:black"|
+*Al and Au 25µm wire bonding
+*Wedge and ball wire bonding
+* Au ribbon (100x20µm) bonding<br />
+|style="background:WhiteSmoke; color:black"|
+*Au 25µm wire bonding
+*Ball wire bonding
+|-
+!style="background:silver; color:black;" align="center" width="60"|Performance
+|style="background:WhiteSmoke; color:black"|
+*Manual operation
+*Wedge bonding:
+**recommended min. bonding area 200 µm x 200 µm
+*Ball bonding:
+**recommended min. bonding area 200 µm x 200 µm
+**recommended temperature 120 <sup>o</sup>C.
+|style="background:WhiteSmoke; color:black"|
+*Semi-automatic and manual operation
+*Bond placement laser pointer
+*recommended min. bonding area 100 µm x 100 µm
+*recommended temperature 120 <sup>o</sup>C.
+|-
+!style="background:silver; color:black" align="center" valign="center"|Substrates
+|colspan="2" style="background:WhiteSmoke; color:black"|
+*Should be able to withstand the wire bonding temperature
+*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)
+|-
+|}
+<br clear="all" />