Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
No edit summary |
mNo edit summary |
||
| (20 intermediate revisions by 6 users not shown) | |||
| Line 1: | Line 1: | ||
Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of__Platinum click here]''' | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
==Platinum deposition == | |||
Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | |||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Platinum/Deposition of Pt in Sputter System (Lesker)|Deposition of Platinum in Sputter System (Lesker)]] | |||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
! | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | |||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! General description | |||
|E-beam deposition of Pt | |||
|Sputter deposition of Pt | |||
|Sputter deposition of Pt | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
! Pre-clean | |||
|Ar ion etch (only in E-beam evaporator Temescal) | |||
|none | |||
|RF Ar clean | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Layer thickness | |||
|10Å - 600nm* | |||
|10Å - 600nm* | |||
|10Å - ? ''discuss with staff'' | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
! Deposition rate | |||
|0.5Å/s to 10Å/s | |||
|up to 3.74 Å/s | |||
|''not known yet, probably similar to 'old' Lesker system | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Batch size | |||
| | |||
*Up to 4x6" wafers | |||
*Up to 3x8" wafers (ask for holder) | |||
*smaller wafers and pieces | |||
| | | | ||
* | *1x4" wafer or | ||
*1x6" wafer | |||
*smaller pieces | *smaller pieces | ||
| | | | ||
* | *Up to 10x4" or 6" wafers | ||
*Many smaller pieces | |||
* | |||
|- | |- | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |||
! Allowed materials | |||
| | |||
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet]. | |||
| | |||
*Almost any that does not degas. | |||
| | |||
*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] | |||
|-style="background:WhiteSmoke; color:black" | |||
! Comment | |||
| Pt tends to exhibit tensile stress, see section on [[Specific Process Knowledge/Characterization/Stress measurement|stress in thin films]]. | |||
| | |||
| | |||
|} | |} | ||
'''*''' ''If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.'' | |||