Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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[[File:IMG_20230228_112922.jpg|thumb||Dicers positioned on 1. floor bldg 346 room 157]] | [[File:IMG_20230228_112922.jpg|thumb||Dicers positioned on 1. floor bldg 346 room 157]] | ||
In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/ | In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring_samples_into_Cleanroom_or_PolyFabLab|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing. | ||
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|LiNbO3**||DAD321 ||B1A862 ||1-3 mm/s ||15'000 ||0.5mm | |LiNbO3**||DAD321 ||B1A862 ||1-3 mm/s ||15'000 ||0.5mm | ||
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|SiC***|| | |SiC***||DAD3241 ||ZP07 ||1 mm/s ||15'000 ||0.5mm | ||
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(*) Multiple cuts at the same location can be done if deeper cuts are needed <br> | (*) Multiple cuts at the same location can be done if deeper cuts are needed <br> | ||