Specific Process Knowledge/Lithography/Development/UV developer: Difference between revisions
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{{cc-nanolab}} | {{cc-nanolab}} | ||
=Developer: TMAH UV-lithography= | =Developer: TMAH UV-lithography= | ||
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! scope=row style="text-align: left;" | Handling method | ! scope=row style="text-align: left;" | Handling method | ||
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* | *Vacuum chuck for 100 mm & 150 mm wafers | ||
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! scope=row style="text-align: left;" | Process temperature | ! scope=row style="text-align: left;" | Process temperature | ||
| Room temperature | | Room temperature | ||
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! scope=row style="text-align: left;" | Process | ! scope=row style="text-align: left;" | Process agitation | ||
| 1 cycles per 30 seconds | | 1 cycles per 30 seconds | ||
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Pre-wet may be done using developer or DI water, or it may be skipped. It consists of a short dispense at medium spin speed (2s @ 1200 rpm). | Pre-wet may be done using developer or DI water, or it may be skipped. It consists of a short dispense at medium spin speed (2s @ 1200 rpm). | ||
Puddle dispense is done by dispensing developer (AZ 726 MIF) to the center of the wafer in order to build up a puddle of developer on the wafer. During the dispense, the wafer may be stopped or rotating slowly (30 rpm). The developer is | Puddle dispense is done by dispensing developer (AZ 726 MIF) to the center of the wafer in order to build up a puddle of developer on the wafer. During the dispense, the wafer may be stopped or rotating slowly (30 rpm). The developer is dispensed at a rate of approximately 225 ml/min. A dispense time of 3s, and 7s is used for 4", and 6" wafers, respectively, corresponding to a volume of 11 ml, and 26 ml, respectively. | ||
Development is carried out by leaving the developer puddle on the wafer for the duration of the development time (puddle time). The rotation is stopped during the development, but the developer may be agitated by rotating the wafer a few turns at low speed, e.g. 2s @ 30 rpm halfway through the development time, in order to facilitate good uniformity. | Development is carried out by leaving the developer puddle on the wafer for the duration of the development time (puddle time). The rotation is stopped during the development, but the developer may be agitated by rotating the wafer a few turns at low speed, e.g. 2s @ 30 rpm halfway through the development time, in order to facilitate good uniformity. | ||
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Special sequences: | Special sequences: | ||
*DCH 100mm SP 60s no | *DCH 100mm SP 60s no spin-off | ||