Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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'''All measurements on this page has been made by Nanolab staff.''' | '''All measurements on this page has been made by Nanolab staff.''' | ||
==Wet etching of Chromium== | ==Wet etching of Chromium== | ||
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! Chromium etch 1 | ! Chromium etch in Fume hood | ||
! Chromium etch Acid 1 wetbench 11 | |||
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Etch of chromium | Etch of chromium | ||
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Etch of Chromium 6" and 8" wafers | |||
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!Link to safety APV and KBA | !Link to safety APV and KBA | ||
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here]. | |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here]. | ||
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here] | |||
|[https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 see Wetbench 11 APV/manual here]. | |||
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here] | [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here] | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Chemical solution | !Chemical solution | ||
|Chrome Etch 18 | |||
|Chrome Etch 18 | |Chrome Etch 18 | ||
|- | |- | ||
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!Process temperature | !Process temperature | ||
|Room temperature | |Room temperature | ||
|Room temperature | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Possible masking materials | !Possible masking materials | ||
|Photoresist (1.5 µm AZ5214E) | |||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|- | |- | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Etch rate | !Etch rate | ||
|~ 150 nm/min at 22°C | |||
|~ 150 nm/min at 22°C | |~ 150 nm/min at 22°C | ||
|- | |- | ||
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!Batch size | !Batch size | ||
|1-7 4" wafers at a time | |1-7 4" wafers at a time | ||
|Up to 5 6" or 8" wafers at a time | |||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Size of substrate | !Size of substrate | ||
|Any size and number that can go inside the beaker in use | |Any size and number that can go inside the beaker in use | ||
|6" and 8" | |||
|- | |- | ||
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|No restrictions. | |No restrictions. | ||
Make a note on the beaker of which materials have been processed. | Make a note on the beaker of which materials have been processed. | ||
| | |||
See the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=580 Cross Contamination Sheet] for Acid 1 | |||
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|} | |} | ||
Latest revision as of 10:55, 30 June 2026
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Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Kemibrug (SDS) and Labmanager Including APV requires login.
All measurements on this page has been made by Nanolab staff.
Wet etching of Chromium
Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. Make sure no other setup is present in the fume hood before you start. You can see the APV here.
We use the following solution to etch chromium:
- Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login) here
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured)
Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste.
Overview of the chromium etch process
| Chromium etch in Fume hood | Chromium etch Acid 1 wetbench 11 | |
|---|---|---|
| General description |
Etch of chromium |
Etch of Chromium 6" and 8" wafers |
| Link to safety APV and KBA | see fumehood APV/manual here. | see Wetbench 11 APV/manual here. |
| Chemical solution | Chrome Etch 18 | Chrome Etch 18 |
| Process temperature | Room temperature | Room temperature |
| Possible masking materials | Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) |
| Etch rate | ~ 150 nm/min at 22°C | ~ 150 nm/min at 22°C |
| Batch size | 1-7 4" wafers at a time | Up to 5 6" or 8" wafers at a time |
| Size of substrate | Any size and number that can go inside the beaker in use | 6" and 8" |
| Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |
See the Cross Contamination Sheet for Acid 1 |