Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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=== Recommended dicing parameters === | === Recommended dicing parameters === | ||
WIP | WIP | ||
DTU Nanolab offers 2 different blades for different | DTU Nanolab offers 2 different blades for different bulk materials. See recommended parameters below. If your sample consists of a thinfilm (less than 5µm) on a bulk carrier, then use parameters for the bulk material. | ||
For other materials/blades consult tool responsible. | For other materials/blades consult tool responsible. | ||
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|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm | |Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm | ||
|- | |||
|LiNbO3**||DAD321 ||B1A862 ||1-3 mm/s ||15'000 ||0.5mm | |||
|} | |} | ||
(*) Multiple cuts at the same location can be done if deeper cuts are needed | (*) Multiple cuts at the same location can be done if deeper cuts are needed <br> | ||
(**) Tested once 26-05-08, no systematic test done | |||
=== Available blades === | === Available blades === | ||