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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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[[File:IMG_20230228_112922.jpg|thumb||Dicers positioned on 1. floor bldg 346 room 157]]
[[File:IMG_20230228_112922.jpg|thumb||Dicers positioned on 1. floor bldg 346 room 157]]


In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.  
In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring_samples_into_Cleanroom_or_PolyFabLab|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.  




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=== Recommended dicing parameters ===
=== Recommended dicing parameters ===
DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.
WIP
DTU Nanolab offers 2 different blades for different bulk materials. See recommended parameters below. If your sample consists of a thinfilm (less than 5µm) on a bulk carrier, then use parameters for the bulk material.  


For other materials/blades consult tool responsible.  
For other materials/blades consult tool responsible.  
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|-
|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm
|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm
|-
|LiNbO3**||DAD321 ||B1A862 ||1-3 mm/s ||15'000 ||0.5mm
|-
|SiC***||DAD3241 ||ZP07 ||1 mm/s ||15'000 ||0.5mm
|}
|}
(*) Multiple cuts at the same location can be done if deeper cuts are needed
(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
(**) Tested once 26-05-08, no systematic test done <br>
(***) Tested once 25-10-29, no systematic test done


=== Available blades ===
=== Available blades ===