Specific Process Knowledge/Lithography/Strip/resistStrip: Difference between revisions
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[[Image:Resist_strip.jpg|400px|thumb|Resist strip bench in D-3]] | [[Image:Resist_strip.jpg|400px|thumb|Resist strip bench in D-3]] | ||
In the resist strip it is allowed to strip resist that is deposited on a metal layer. It is not allowed to strip resist with metal on top (lift off). Furthermore no SU-8 is allowed in the bath. | |||
There are one Remover 1165 bath for stripping and one IPA bath for rinsing. | There are one Remover 1165 bath for stripping and one IPA bath for rinsing. | ||
Latest revision as of 08:40, 4 May 2026
Resist Strip
In the resist strip it is allowed to strip resist that is deposited on a metal layer. It is not allowed to strip resist with metal on top (lift off). Furthermore no SU-8 is allowed in the bath.
There are one Remover 1165 bath for stripping and one IPA bath for rinsing.
Here are the main rules for resist strip use:
- Place the wafers in a wafer holder and put them in the first bath for 10 min, this time is depending how much resist you have on the surface.
- After the strip rinse your wafers in the IPA bath for 2-3 min.
- Rinse your wafers for 4-5 min. in running water after stripping.
The user manual and contact information can be found in LabManager: Resist Strip - requires login