Specific Process Knowledge/Lithography/Strip/plasmaAsher03: Difference between revisions
Created page with "=Plasma Asher 3: Descum= 400px|thumb|Plasma Asher 3: Descum is a low power plasma asher dedicated for descumming on smaller substrates. Product name: Diener Pico Plasma Asher<br> Year of purchase: 2014 The Plasma Asher 3: Descum is dedicated for resist descum, i.e. removal of remains resist traces after development. It has a small chamber, so you can only load a single 100 mm substrate, or a few smaller pieces. In this machine, only Ox..." |
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Latest revision as of 11:38, 12 January 2026
Plasma Asher 3: Descum
Product name: Diener Pico Plasma Asher
Year of purchase: 2014
The Plasma Asher 3: Descum is dedicated for resist descum, i.e. removal of remains resist traces after development. It has a small chamber, so you can only load a single 100 mm substrate, or a few smaller pieces.
In this machine, only Oxygen is used for processing.
Typical process parameters:
Process: Photoresist descumming
Pressure: 0.2-0.8 mbar
Gas: 45 sccm O2
Power: 100 W (100%)
Time: 1 -10 minutes (depending on photoresist type and thickness)
Other materials have not been tested.
The user manual, user APV, and contact information can be found in LabManager - requires login
Process Information
Detailed information about descum processing on Plasma asher 3: Descum can be found here.