Specific Process Knowledge/Lithography/Descum: Difference between revisions
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= Descum Comparison Table = | |||
{| class="wikitable" | |||
|- | |||
! | |||
! [[Specific_Process_Knowledge/Lithography/Descum#Plasma Asher 3: Descum|Plasma Asher 3: Descum]] | |||
! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher 4|Plasma Asher 4 (Clean)]] | |||
! [[Specific_Process_Knowledge/Lithography/Descum#Plasma Asher 5|Plasma Asher 5 (Dirty)]] | |||
|- | |||
! scope=row style="text-align: left;" | Purpose | |||
| Resist descum | |||
| | |||
*Resist stripping | |||
*Resist descum | |||
| | |||
*Resist stripping | |||
*Resist descum | |||
|- | |||
! scope=row style="text-align: left;" | Method | |||
| Plasma ashing | |||
| Plasma ashing | |||
| Plasma ashing | |||
|- | |||
! scope=row style="text-align: left;" | Process gasses | |||
| O<sub>2</sub> (50 sccm) | |||
| | |||
*O<sub>2</sub> (0-500 sccm) | |||
*N<sub>2</sub> (0-500 sccm) | |||
| | |||
*O<sub>2</sub> (0-500 sccm) | |||
*N<sub>2</sub> (0-500 sccm) | |||
*CF<sub>4</sub> (0-200 sccm) | |||
|- | |||
! scope=row style="text-align: left;" | Process power | |||
| 10-100 W (10-100%) | |||
| 150-1000 W | |||
| 150-1000 W | |||
|- | |||
! scope=row style="text-align: left;" | Substrate batch | |||
| | |||
*Chips: several | |||
*50 mm wafer: several | |||
*100 mm wafer: 1 | |||
| | |||
*Chips: several | |||
*50 mm wafer: several | |||
*100 mm wafer: 1-25 | |||
*150 mm wafer: 1-25 | |||
*200 mm wafer: 1-25 | |||
| | |||
*Chips: several | |||
*50 mm wafer: several | |||
*100 mm wafer: 1-25 | |||
*150 mm wafer: 1-25 | |||
*200 mm wafer: 1-25 | |||
|- | |||
! scope=row style="text-align: left;" | Substrate materials | |||
| | |||
*<span style="color:red">'''No polymer substrates'''</span><br> | |||
*Silicon substrates | |||
*III-V substrates | |||
*Glass substrates | |||
*Films, or patterned films, of any material except type IV (Pb, Te) | |||
| | |||
*<span style="color:red">'''No metals'''</span><br> | |||
*<span style="color:red">'''No metal oxides'''</span><br> | |||
*<span style="color:red">'''No III-V materials'''</span><br> | |||
*Silicon substrates | |||
*Glass substrates | |||
*Polymer substrates | |||
*Films, or patterned films, of resists/polymers | |||
| | |||
*Silicon substrates | |||
*III-V substrates | |||
*Glass substrates | |||
*Polymer substrates | |||
*Films, or patterned films, of any material except type IV (Pb, Te) | |||
|} | |||
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{{:Specific Process Knowledge/Lithography/Descum/plasmaAsher03}} | {{:Specific Process Knowledge/Lithography/Descum/plasmaAsher03}} | ||
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=Decommisioned tools= | =Decommisioned tools= | ||
<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span> | <span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span> | ||
[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1|Information about decommissioned tool can be found here.]] | [[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1|Information about decommissioned tool can be found here.]] | ||
<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span> | <span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span> | ||
[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2|Information about decommissioned tool can be found here.]] | [[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2|Information about decommissioned tool can be found here.]] | ||
<br clear="all" /> | <br clear="all" /> | ||