Specific Process Knowledge/Lithography/Coaters: Difference between revisions

=Coater Comparison Table=

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*In-line substrate HMDS priming

*Coating and baking of  

**AZ nLOF 2020

**AZ 5214E

*Coating and baking of

**BARC (DUV42S-6)

**KRF M35G

**UVN2300-0.8

*In-line substrate HMDS priming

*Coating and baking of  

**AZ 4562

*Edge bead removal on novolac-based resist and SU-8

*Coating of

**SU-8

**AZ nLOF

*Edge bead removal

*Coating of E-beam resists

** CSAR, ZEP, PMMA/MMA, HSQ(FOx)

**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8

*Coating of imprint resists

*Coating of

**SU-8

**mr-DWL

**other resists

*Spraying imprint resist

*Spraying photoresist

*Spraying of other solutions

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* Cassette-to-cassette

* Vacuum handling and detection

* Vacuum spin chuck

* Cassette-to-cassette

* Vacuum handling and detection

* Vacuum spin chuck

* Cassette-to-cassette

* Vacuum handling and detection

* Vacuum spin chuck  

* Single substrate

* Vacuum chuck for 4" and 6"

* 4" non-vacuum chuck for fragile substrates

* Single substrate

* Vacuum chucks for chips, 2", 4", and 6"

* 4" edge handling chuck

* Single substrate

* Vacuum chucks for chips, 4", and 6"

Can handle almost any sample size and shape

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* AZ MiR 701 (29cps) resist

* AZ nLOF 2020 resist

* AZ 5214E resist

* PGMEA solvent for backside rinse and spinner bowl cleaning

* DUV42S-6 (BARC)

* KRF M230Y resist

* KRF M35G resist

* PGMEA solvent for edge bead removal and backside rinse

* AR-P 6200.09 (CSAR) for 2", 4", and 6"

* AZ5214E for 2", 4", and 6"

* AZ4562 for 4", and 6"

* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning

No permanent media

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*50 mm wafers (tool change required)

*100 mm wafers

*150 mm wafers

*200 mm wafers (tool change required)

*100 mm wafers

*150 mm wafers

*200 mm wafers (may require tool change)

*2" or 50 mm wafers

*100 mm wafers

*150 mm wafers

*100 mm wafer

*150 mm wafer  

*50 mm wafers

*100 mm wafers

*150 mm wafer

*small pieces down to 5x5 mm2

*100 mm wafers

*150 mm wafer

*small pieces down to 5x5 mm2

Any sample(s) that fit inside machine

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*Silicon  

*Glass

'''No resist or crystalbond allowed in the HMDS module'''

*Silicon  

*Glass

*Silicon  

*III-V materials

'''No resist or crystalbond allowed in the HMDS module'''

All cleanroom materials except III-V materials

*Silicon  

*III-V materials

*Glass

All PolyFabLab materials

*All chemicals to be spray coated must be approved specifically for spray coating

*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved

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=Spin coating=

==Softbake==

After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.

=Decommisioned tools=

<span style="color:red">The spin track was decommissioned 2018-02-01.</span>

[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]