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== Process information ==
== Process information ==


[[/Acceptance Test|'''Acceptance Test information is found here''']]. Describes tests of '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.
[[/Acceptance Test|'''Acceptance Test information is found here''']]. Describes '''thickness uniformity''', '''side wall deposition''', '''sheet resistance''', and '''use of the ion source'''.


===Materials available in the E-beam evaporator (Temescal)===
===Materials===


[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]]<br>
[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]]<br>
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===Thickness measurement, deposition rate and process control===
===Thickness measurement, deposition rate and process control===
Read about how the machine measures the thickness of the growing film using a quartz crystal monitor, how accurately you can control the rate/thickness, and other useful information about e-beam deposition here: [[/Good to know about the Temescal#Deposition rate and thickness measurement accuracy|Thickness, rate, process control]].  
How the machine measures the thickness of the growing film using a quartz crystal monitor, how accurately is the control of the rate/thickness, and other useful information about e-beam deposition is found here: [[/Good to know about the Temescal#Deposition rate and thickness measurement accuracy|Thickness, rate, process control]].


===Particulates in the films===
===Particulates in the films===
Read about optimizing film quality including how to minimize the number of  [[/Particulates in Temescal Au films|particulates in Au films in the Temescal]].
Read about optimizing film quality including how to minimize the number of  [[/Particulates in Temescal Au films|particulates in Au films in the Temescal]].


==Ion source==
===Ion source===
[[/Ion source in E-beam evaporator (Temescal)|Information on the ion source]].
[[/Ion source in E-beam evaporator (Temescal)|Information on the ion source]].


==Equipment performance and process related parameters for the Temescal E-beam evaporator==
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
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| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
*Almost any that does not outgas and is approved in the cleanroom.
*Quartz wafers
*Pyrex wafers
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]  
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]  
|-  
|-  
| style="background:LightGrey; color:black"|Material allowed on the substrate
| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon oxide
*Almost any that does not outgas and is approved in the cleanroom.
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|-  
|-  
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