Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions

@@ Line 113: / Line 113: @@
 ! rowspan="3" align="center" style="background:#f0f0f0;"| First Bond
 | Ultrasonic Power (US)
-| 150-200
+| 160
 |-
 | Bond Time
-| 80-200
+| 80
 |-
 | Bond Force
-| 250-450
+| 350
 |-
 ! rowspan="3" align="center" style="background:#f0f0f0;"| Second Bond
 | Ultrasonic Power (US)
-| 150-200
+| 180
 |-
 | Bond Time
-| 80-200
+| 80
 |-
 | Bond Force
-| 300-400
+| 350
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Wire
@@ Line 140: / Line 140: @@
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Loop
 | Loop Height
-| 500(short length bonds)-5000 (long length bonds)
+| 500-2500
 |-
 | Tail Mode (Clamp Feed Length)
-| 350-500
+| 200-350
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Temperature
 |-
 | Stage
-|0-120 (No need of temp when high US(>300))
+|80-120
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Bond Positions
 | First Bond (X1, Y1)
-| Teach first bond to register coordinates
+| Teach first bond
 |-
 | Second Bond (X2, Y2)
-|Teach second bond to register coordinates
+|Teach second bond
-|-
-! rowspan="2" align="center" style="background:#f0f0f0;"|Bond directions
-|-
-|Package (P) & chip (1)
-|P>P
->1
-P>1
->P
 |-
 |}