Jump to content

Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions

← Older edit
VisualWikitext
Prakus (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
96 edits
No edit summary
Prakus (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
96 edits
No edit summary
Tag: Manual revert
 
(8 intermediate revisions by the same user not shown)
Line 6: Line 6:




TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire.
The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire. 
===Table: HB100 Full Technical Specifications===


{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
Line 114: Line 103:
|}
|}
''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''
''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''
-------------------------------------
The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person.
The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.
=== HB100 Bonding Parameters – 25 µm Gold Wire===
{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
|+ style="font-weight:bold; font-size:110%;" |
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| First Bond
| Ultrasonic Power (US)
| 160
|-
| Bond Time
| 80
|-
| Bond Force
| 350
|-
! rowspan="3" align="center" style="background:#f0f0f0;"| Second Bond
| Ultrasonic Power (US)
| 180
|-
| Bond Time
| 80
|-
| Bond Force
| 350
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Wire
| Wire Diameter
| 25 µm (Gold)
|-
| Wire Detect
| First Bond: 20 / Second Bond: 0
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Loop
| Loop Height
| 500-2500
|-
| Tail Mode (Clamp Feed Length)
| 200-350
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Temperature
|-
| Stage
|80-120
|-
! rowspan="2" align="center" style="background:#f0f0f0;"| Bond Positions
| First Bond (X1, Y1)
| Teach first bond
|-
| Second Bond (X2, Y2)
|Teach second bond
|-
|}




===Process parameters for Gold wire (25µm)===
* For  more details contact  thcl@dtu.dk or prakus@dtu.dk
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Wire_Bonder/new_page_name"