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{{cc-nanolab}}
=TPT HB100 Wire Bonder =
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.


'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
<br>


==TPT HB100 Wire Bonder ==
[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]]
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
 
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''


[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]


==Ball Wire Bonder K&S 4524==
=Ball Wire Bonder K&S 4524=
<!-- copyright issue kabi - replace with actual photo and numbering
<!-- copyright issue kabi - replace with actual photo and numbering
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
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==Equipment performance and process related parameters==
=Equipment performance and process related parameters=


[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]  
[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]  
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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested)
* Au ribbon (100x20µm) bonding<br />
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Au 25µm wire bonding
*Au 25µm wire bonding
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