Jump to content

Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

From LabAdviser
← Older edit
VisualWikitext
Mmat (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators
1,954 edits
Prakus (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
96 edits
No edit summary
 
(7 intermediate revisions by 2 users not shown)
Line 1: Line 1:
{{cc-nanolab}}
=TPT HB100 Wire Bonder =
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.


'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
<br>


==TPT HB100 Wire Bonder ==
[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]]
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
 
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''


[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]


==Ball Wire Bonder K&S 4524==
=Ball Wire Bonder K&S 4524=
<!-- copyright issue kabi - replace with actual photo and numbering
<!-- copyright issue kabi - replace with actual photo and numbering
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
Line 28: Line 24:
<br clear=all>
<br clear=all>


==Equipment performance and process related parameters==
=Equipment performance and process related parameters=


[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]  
[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]  
Line 37: Line 33:
!border="none" style="background:silver; color:black;" align="center"|Equipment  
!border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder K&S 4524</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested)
* Au ribbon (100x20µm) bonding<br />
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Au 25µm wire bonding
*Au 25µm wire bonding

Latest revision as of 09:12, 8 September 2025

TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought in 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT HB 100 wire bonder: process details

TPT HB100 Wire Bonder

Ball Wire Bonder K&S 4524

K&S 4524 ball wire bonder

The bonder is currently in building 346 Phoenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond


Equipment TPT HB100 Wire Bonder Ball Wire Bonder K&S 4524
Purpose
  • Al and Au 25µm wire bonding
  • Wedge and ball wire bonding
  • Au ribbon (100x20µm) bonding
  • Au 25µm wire bonding
  • Ball wire bonding
Performance
  • Manual operation
  • Wedge bonding:
    • recommended min. bonding area 200 µm x 200 µm
  • Ball bonding:
    • recommended min. bonding area 200 µm x 200 µm
    • recommended temperature 120 oC.
  • Semi-automatic and manual operation
  • Bond placement laser pointer
  • recommended min. bonding area 100 µm x 100 µm
  • recommended temperature 120 oC.
Substrates
  • Should be able to withstand the wire bonding temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Wire_Bonder&oldid=54364"