Specific Process Knowledge/Thin film deposition/Deposition of NbTi: Difference between revisions
Appearance
Tag: Manual revert |
|||
| (7 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
=Niobium | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_NbTi click here]''' | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
<br clear="all" /> | |||
=Niobium Titanium (NbTi)= | |||
Niobium–titanium (Nb‑Ti) is a ductile, readily machinable alloy that merges niobium’s superconductivity with titanium’s strength, yielding a rigid, corrosion‑resistant material valued in cryogenic and high‑field environments. | Niobium–titanium (Nb‑Ti) is a ductile, readily machinable alloy that merges niobium’s superconductivity with titanium’s strength, yielding a rigid, corrosion‑resistant material valued in cryogenic and high‑field environments. | ||
| Line 11: | Line 18: | ||
Users can deposit NbTi in either the Sputter-System (Lesker) or the Sputter-System Metal-Nitride(PC3) (Preferable option) | Users can deposit NbTi in either the Sputter-System (Lesker) or the Sputter-System Metal-Nitride(PC3) (Preferable option) | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of NbTi/Deposition of NbTi in Sputter-System Metal-Nitride PC3 | * [[Specific Process Knowledge/Thin film deposition/Deposition of NbTi/Deposition of NbTi in Sputter-System Metal-Nitride PC3|Deposition of NbTi in Sputter-System Metal-Nitride(PC3)]] | ||
==Comparison of sputter systems for alloy deposition== | ==Comparison of sputter systems for alloy deposition== | ||
| Line 62: | Line 69: | ||
*Up to 600 °C | *Up to 600 °C | ||
| | | | ||
*Up to 400 °C | *Up to 400 °C (Room temperature from 2021) | ||
|- | |- | ||