Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
[[/Deposition of Tungsten Nitride| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/> | |||
[[/Deposition of Tantalum Nitride| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/> | |||
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[[/Sputter deposition of metals and alloys|FeMn]]<br/> | [[/Sputter deposition of metals and alloys|FeMn]]<br/> | ||
[[/Sputter deposition of metals and alloys|MnIr]]<br/> | [[/Sputter deposition of metals and alloys|MnIr]]<br/> | ||
[[/ | [[/Deposition of NbTi|NbTi]] <br/> | ||
[[/Deposition of NiFe|NiFe]]<br/> | [[/Deposition of NiFe|NiFe]]<br/> | ||
[[/Deposition of NiV|NiV]] alloy <br/> | [[/Deposition of NiV|NiV]] alloy <br/> | ||