Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions
| (2 intermediate revisions by the same user not shown) | |||
| Line 3: | Line 3: | ||
==Sputtering of Nickel Vanadium== | ==Sputtering of Nickel Vanadium== | ||
Nickel Vanadium may be sputter deposited in the Sputter-system (Lesker) and the Sputter-system Metal-Oxide. The following pages show both process parameters and data on surface roughness of the deposited films: | Nickel Vanadium may be sputter deposited in the Sputter-system (Lesker) and the Sputter-system Metal-Oxide (PC1). The following pages show both process parameters and data on surface roughness of the deposited films: | ||
* [[/Sputtering of NiV in Lesker|Sputtering of NiV in Lesker]] | * [[/Sputtering of NiV in Lesker|Sputtering of NiV in Sputter-System (Lesker)]] | ||
* [[/Sputtering of NiV in Sputter-System Metal-Oxide (PC1)|Sputtering of NiV in Sputter-System Metal-Oxide (PC1)]] | * [[/Sputtering of NiV in Sputter-System Metal-Oxide (PC1)|Sputtering of NiV in Sputter-System Metal-Oxide (PC1)]] | ||
* [[/Sputtering of NiV in Wordentec|Sputtering of NiV in Wordentec]] (tool now decommissioned, but results | * [[/Sputtering of NiV in Wordentec|Sputtering of NiV in Wordentec]] (tool now decommissioned, but results are of general interest) | ||
| Line 108: | Line 108: | ||
*Substrate rotation | *Substrate rotation | ||
*Substrate RF Bias (optional) | *Substrate RF Bias (optional) | ||
*Substrate heating to 600 C | |||
|- | |- | ||