Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.

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! Layer thickness

|10 Å to 200 nm  

| very thin, few nm range

| very thin, few nm range

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! Deposition rate

|1 Å/s (can be adjusted to around 5 Å/s)

|Depends on process parameters, 1-10 Å/s  

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!Allowed materials

* All samples allowed in the SEM Supra 2 or 3

! Comment

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* Pumpdown approx 20 min.

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== Resistive thermal evaporation of Au ==

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! QC Recipe:

! Standard recipes/TiAu or Cr/Au

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!QC limits

!Both e-beam evaporators

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Thickness is measured in 5 points with a stylus profiler. <br>

Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au or Cr/Au films.

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