Decommissioned Equipment: Difference between revisions
| (4 intermediate revisions by the same user not shown) | |||
| Line 7: | Line 7: | ||
* [[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420 | KLA-Tencor Surfscan 6420]] | * [[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420 | KLA-Tencor Surfscan 6420]] | ||
:(replaced by [[Specific Process Knowledge/Characterization/Particle Scanner Takano | Takano WM-7SR]]) | :(replaced by [[Specific Process Knowledge/Characterization/Particle Scanner Takano | Takano WM-7SR]]) | ||
*[[Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test|Optical Profiler (Sensofar) acceptance test]] | |||
==Lithography Equipment== | ==Lithography Equipment== | ||
[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1|PlasmaAsher1]] | *[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1|PlasmaAsher1]] | ||
[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2|PlasmaAsher2]] | *[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2|PlasmaAsher2]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|Spin Track 1 + 2 processing]] | |||
==Thin Film Equipment== | ==Thin Film Equipment== | ||
* Thin Film Deposition | * Thin Film Deposition | ||
:*[[Specific Process Knowledge/Thin film deposition/Deposition of AlTi/AlTi deposition in PVD co-sputter co-evaporation|AlTi deposition in PVD co-sputter co-evaporation]] | :*[[Specific Process Knowledge/Thin film deposition/Deposition of AlTi/AlTi deposition in PVD co-sputter co-evaporation|AlTi deposition in PVD co-sputter co-evaporation]] | ||
:*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 4" LPCVD nitride furnace|Deposition of low stress nitride using the 4" LPCVD nitride furnace]] | |||
* Thermal Process | * Thermal Process | ||
| Line 32: | Line 32: | ||
:* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | :* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]] | ||
:*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]] | :*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]] | ||
:*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/RIE1 Travka results|RIE1 Travka results]] | |||
:*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/RIE2 Travka results|RIE2 Travka results]] | :*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/RIE2 Travka results|RIE2 Travka results]] | ||
| Line 38: | Line 39: | ||
*[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | *[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | ||
== | |||
==Delete Pages== | |||