Latest revision as of 21:17, 20 June 2025

List of Decommissioned Equipment

Below is a list of decommissioned equipment that is kept as reference for other Equipment.

Characterization Equipment

(replaced by Takano WM-7SR)

Optical Profiler (Sensofar) acceptance test

Lithography Equipment

Thin Film Equipment

Thin Film Deposition

Thermal Process

RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
APOX furnace - For growing of very thick oxide layers
III-V Oven (D4) - For oxidation of Al_xGaAs layers.
Old Resist Pyrolysis furnace - For pyrolysis of different resist
Noble furnace - For annealing and oxidation of non-clean wafers

Dry Etch Equipment

RIE (Reactive Ion Etch)

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-=List of decommissioned Equipment=
+=List of Decommissioned Equipment=
 Below is a list of decommissioned equipment that is kept as reference for other Equipment.
+==Characterization Equipment==
+* [[Specific Process Knowledge/Characterization/X-Ray Diffractometer | X-Ray Diffractometer]]
+* [[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420 | KLA-Tencor Surfscan 6420]]
+:(replaced by [[Specific Process Knowledge/Characterization/Particle Scanner Takano | Takano WM-7SR]])
+*[[Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test|Optical Profiler (Sensofar) acceptance test]]
+==Lithography Equipment==
+*[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1|PlasmaAsher1]]
+*[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2|PlasmaAsher2]]
+*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|Spin Track 1 + 2 processing]]
+==Thin Film Equipment==
+* Thin Film Deposition
+:*[[Specific Process Knowledge/Thin film deposition/Deposition of AlTi/AlTi deposition in PVD co-sputter co-evaporation|AlTi deposition in PVD co-sputter co-evaporation]]
+:*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride/Deposition of low stress nitride using the 4" LPCVD nitride furnace|Deposition of low stress nitride using the 4" LPCVD nitride furnace]]
+* Thermal Process
+:*[[Specific Process Knowledge/Thermal Process/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si-based materials''
+:*[[Specific Process Knowledge/Thermal Process/Furnace APOX|APOX furnace]] - ''For growing of very thick oxide layers''
+:*[[Specific Process Knowledge/Thermal Process/D4 III-V Oven|III-V Oven (D4)]] - ''For oxidation of Al<sub>x</sub>GaAs layers.''
+:*[[Specific Process Knowledge/Thermal Process/Resist Pyrolysis Furnace|Old Resist Pyrolysis furnace]] - ''For pyrolysis of different resist
+:*[[Specific Process Knowledge/Thermal Process/Furnace Noble|Noble furnace]] - ''For annealing and oxidation of non-clean wafers''
+==Dry Etch Equipment==
+* [[Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)|RIE (Reactive Ion Etch)]]
+:* [[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Si etch using RIE1 or RIE2]]
+:* [[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE1 or RIE2]]
+:* [[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of Silicon Nitride using RIE]]
+:*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask|Images of 1SIO2mbr with burned resist mask]]
+:*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/RIE1 Travka results|RIE1 Travka results]]
+:*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2/RIE2 Travka results|RIE2 Travka results]]
+==Other Equipment==
+* [[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]]
+*[[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
+==Delete Pages==