Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
| (3 intermediate revisions by the same user not shown) | |||
| Line 5: | Line 5: | ||
== Molybdenum deposition == | == Molybdenum deposition == | ||
Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | ||
==Sputtering of Molybdenum== | |||
Molybdenum may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]]" and "[[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]]"). See more in link here and the chart below. | |||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum/Mo Sputtering in Cluster Lesker PC1|Mo Sputtering in Sputter-System Metal-Oxide(PC1)]] | |||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||