Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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*Up to 4x6" wafers or | *Up to 4x6" wafers or | ||
*Up to 3x8" wafers | *Up to 3x8" wafers | ||
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*smaller pieces | *smaller pieces | ||
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*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas. See cross-contamination | *Almost any as long as it does not outgas. See cross-contamination sheet in Labmanager. | ||
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*Almost any | * Almost any that do not degas. See also the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet] | ||
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*Almost any | *Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] | ||
|-style="background:whitesmoke; color:black" | |-style="background:whitesmoke; color:black" | ||
! Comment | ! Comment | ||
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'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk'' | '''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk'' | ||