Specific Process Knowledge/Back-end processing: Difference between revisions
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! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.''' | ! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.''' | ||
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Please note that the training on machines requires the " | Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information. | ||
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**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
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*Wafer | *Wafer Dicing and Machining | ||
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | **[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | ||
**[[/Polishing machine|Polisher/Lapper machine]] | **[[/Polishing machine|Polisher/Lapper machine]] | ||
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**[[/FlipScribe|FlipScribe]] | **[[/FlipScribe|FlipScribe]] | ||
**[[/FlexScribe|FlexScribe]] | **[[/FlexScribe|FlexScribe]] | ||
** | **Wafer Scriber | ||
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | **[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | ||
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | **[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | ||