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Specific Process Knowledge/Pattern Design/Mask Specifications: Difference between revisions

Mmat (talk | contribs)
Mmat (talk | contribs)
 
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Layer (GDS number): 01 <br>
Layer (GDS number): 01 <br>
Mask Type: Digitised data= Dark, right reading <br>
Mask Type: ''Digitised data= Dark, right reading'' <br>
Text(max 30 characters): init-2019-Nitride-etch <br>
Text(max 30 characters): ''init-2019-Nitride-etch'' <br>


Layer (GDS number): 02 <br>
Layer (GDS number): 02 <br>
Mask Type: Digitised data= Clear, Wrong reading <br>
Mask Type: ''Digitised data= Clear, Wrong reading'' <br>
Text(max 30 characters): init-2019-KOH-backside
Text(max 30 characters): ''init-2019-KOH-backside''


== For 7" masks ==
== For 7" masks ==
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: Chromium down
: Chromium down


GDS-file: GLO006_v7.gds
GDS-file: GLO006_v7.gds<br>
Top cell: wafer
Top cell: wafer


Layer (GDS number): 01  
Layer (GDS number): 01 <br>
Mask Type: Digitised data= Dark, right reading
Mask Type: ''Digitised data= Dark, right reading''<br>
Text(max 30 characters): init-2019-Nitride-etch
Text(max 30 characters): ''init-2019-Nitride-etch''


Layer (GDS number): 02
Layer (GDS number): 02<br>
Mask Type: Digitised data= Clear, Wrong reading
Mask Type: ''Digitised data= Clear, Wrong reading''<br>
Text(max 30 characters): init-2019-KOH-backside
Text(max 30 characters): ''init-2019-KOH-backside''