Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
info about new laser source |
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==Laser Micromachining Tool == | ==Laser Micromachining Tool == | ||
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The page will be updated very soon. | The page will be updated very soon. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager | '''The user manual(s), user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=309 LabManager]'''. | ||
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* a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this | It is equipped with 2 high power lasers: | ||
* a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this [http://www.time-bandwidth.com/upload/press/weingartenlasertechnikjournalvol6issue3p51.pdf article]) with a pulse repetition rate from 200kHz up to 8000kHz. | |||
* a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz (currently out of use). | * a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz (currently out of use). | ||
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The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info [[Specific_Process_Knowledge/Pattern_Design| here]]. | The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info [[Specific_Process_Knowledge/Pattern_Design| here]]. | ||
==Process Examples== | |||
A process example for cutting silicon grooves can be found [[/Silicon cutting and milling| <b>here</b>]]. | |||
== Technical specifications == | == Technical specifications == | ||
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* 1064nm, F255mm: 41 W | * 1064nm, F255mm: 41 W | ||
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* [[ | * [[Media:AvgPower 1064nm F255mm.png|Graph 1064nm, F255nm Avg. output power]] | ||
* [[ | * [[Media:AvgPower 355nm F103mm.png|Graph 355nm, F103nm Avg. output power]] | ||
|} | |} | ||
|- | |- | ||
|style="background:LightGrey; color:black"|[[ | |style="background:LightGrey; color:black"|[[Media:140618 AverageOutputPower IPG.jpg|Output power@100%(laser IPG – nanosecond)]] | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Repetition rate : 10kHz to 100kHz (Currently non-available) | Repetition rate : 10kHz to 100kHz (Currently non-available) | ||
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*[[/Laser Micromachining Tool acceptance test|Results from Laser Micromachining Tool acceptance test]] | *[[/Laser Micromachining Tool acceptance test|Results from Laser Micromachining Tool acceptance test]] | ||
=== Laser Processing parameters === | === Laser Processing parameters === | ||
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| 1 | | 1 | ||
| N/A | | N/A | ||
| [[ | | [[Media:Dicing Si 532nm f255mm.xls|Silicon dicing green parameters]] | ||
| Easily break silicon in cristal plan. Depth of the groove : 25µm | | Easily break silicon in cristal plan. Depth of the groove : 25µm | ||
|- style="background:LightGray;text-align:center" valign="top" | |- style="background:LightGray;text-align:center" valign="top" | ||
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| 4 | | 4 | ||
| 50 µm | | 50 µm | ||
| [[ | | [[Media:TB 1064nm 255mm cutting Si Si3N4.xls|Silicon nitride cutting parameters]] | ||
| Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested. | | Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested. | ||
|- | |- | ||
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| 1 | | 1 | ||
| N/A | | N/A | ||
| [[ | | [[Media:TB 532nm 255mm cutting Ni 320um.xls|Cutting Ni 320µm parameters]] | ||
| Cutting through only blue tape left | | Cutting through only blue tape left | ||
|- | |- | ||
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| 13 | | 13 | ||
| 20 µm | | 20 µm | ||
| [[ | | [[Media:TB 1064nm 255mm cutting pyrex microfluidic hole.xls|Cutting Pyrex 1000µm for microfluidic hole parameters]] | ||
| Increase/decrease the number of iteration to increase/decrease the width of the hole. [[ | | Increase/decrease the number of iteration to increase/decrease the width of the hole. [[Media:Pyrex 10um hole chanel.jpg|Microscope view of the chanel]] | ||
|- | |- | ||
|- style="background:LightGray;text-align:center" valign="top" | |- style="background:LightGray;text-align:center" valign="top" | ||
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| 4 | | 4 | ||
| 20 µm | | 20 µm | ||
| [[ | | [[Media:TB 1064nm 255mm cutting Pyrex 525um.xls|Cutting Pyrex 525µm parameters]] | ||
| Cutting through. Dicing circle. Can probably be optimized: 3 lines may be enough and half the iterations (tried by Azeem) | | Cutting through. Dicing circle. Can probably be optimized: 3 lines may be enough and half the iterations (tried by Azeem) | ||
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| [[ | | [[Media:TB 532nm 255mm cutting shim steel 50um.xls|Cutting steel 50µm]] | ||
| Cutting shrim for Injection molder. | | Cutting shrim for Injection molder. | ||
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| | | | ||
| [[ | | [[Media:TB 532nm 255mm cutting shim steel 100um.xls|Cutting steel 100µm]] | ||
| Cutting shrim for Injection molder. | | Cutting shrim for Injection molder. | ||
|- | |- | ||
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| | | | ||
| [[ | | [[Media:TB 532nm 255mm cutting shim steel 200um.xls|Cutting steel 200µm]] | ||
| Cutting shrim for Injection molder. | | Cutting shrim for Injection molder. | ||
|- | |- | ||
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| 4 | | 4 | ||
| 20 | | 20 | ||
| [[ | | [[Media:Shaddowmask al lambda 532nm, F 255mm.xls|cutting Al 400µm]] | ||
| Cutting shadowmask for Wordentec. | | Cutting shadowmask for Wordentec. | ||
|- | |- | ||
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| 4 | | 4 | ||
| 40 | | 40 | ||
| [[ | | [[Media:Aluminium cut IPG Lambda 1064nm, F 255mm.xls|cutting Al 600µm]] | ||
| Shadowmask. | | Shadowmask. | ||
|} | |} | ||