Specific Process Knowledge/Lithography/nLOF: Difference between revisions

Revision as of 09:13, 9 April 2025 view source Taran (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891 3,528 edits m →Post-exposure bake ← Older edit		Latest revision as of 09:13, 9 April 2025 view source Taran (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891 3,528 edits m →Post-exposure bake
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	The recommended PEB for nLOF is 60 seconds at 110°C, regardless of resist film thickness.		The recommended PEB for nLOF is 60 seconds at 110°C, regardless of resist film thickness.


	===PEB baking time investigation===		===PEB baking time investigation===