Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing: Difference between revisions

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-Aligner: Maskless 04 is both a direct writer and not a direct laser writer. In Raster mode, it works like MLA 1, where an image is projected onto the substrate surface, and stepped across the substrate in order to produce the entire pattern. In Vector mode, it is a direct laser writer, where a focused laser beam is moved across the substrate surface in order to trace out the pattern.
+Aligner: Maskless 04 is both a direct laser writer and not a direct laser writer. In Raster mode, it works like MLA1, where an image is projected onto the substrate surface, and stepped across the substrate in order to produce the entire pattern. In Vector mode, it is a direct laser writer, where a focused laser beam is moved across the substrate surface in order to trace out the pattern.
 The writing head of the Aligner: Maskless 04 moves only in the z-direction. Using a focusing system, the maskless aligner is able to do real-time autofocus. The defocus process parameter is used to compensate offsets in the focusing mechanism, and to optimize printing quality in different resists and varying thicknesses.
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 *Laser Power [0-120 mW]; the output power of the diode laser
 *Exposure Velocity [0-200 mm/s]; the movement speed of the stage during exposure
-The Pen determines the size of the spot on the substrate surface and thus the ultimate resolution. It may also affect the intensity available at the substrate. For highly sensitive resists, the Transmission can be used to limit the available intensity at the substrate (lowering the required Exposure Velocity in a more reasonable value). The Laser Power directly affects the intensity available at the substrate. The Exposure Velocity determines the dwell time at each point on the substrate, and thus the effective dose received by the resist at the intensity determined by the three other parameters.
+The Pen determines the size of the spot on the substrate surface and thus the ultimate resolution. It may also affect the intensity available at the substrate. For highly sensitive resists, the Transmission can be used to limit the available intensity at the substrate (lowering the required Exposure Velocity to a more reasonable value). The Laser Power directly affects the intensity available at the substrate. The Exposure Velocity determines the dwell time at each point on the substrate, and thus the effective dose received by the resist at the intensity determined by the three other parameters.
 Aligner: Maskless 04 offers not only two exposure modes, but also two autofocus modes; optical or pneumatic. The defocus process parameter is used to compensate for offsets between the autofocus mechanism and the focal point of the exposure light, and simultaneously optimize print quality in different resists and varying thicknesses. The "defoc" parameter us a unitless value, representing ±100% of the available correction available above and below the initial focus point established during loading of the substrate. One defoc step is approximately 0.25µm. Positive defoc is into the resist, i.e. writehead moves down when defoc is increased.