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| * [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] | | * [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] |
| * [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] | | * [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] |
| <!--
| | * Dry Etching without mask |
| == Materials for structuring ==
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| *Polymers
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| ** SU-8
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| *** [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
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| ** Topas
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| *** [[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
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| *** [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
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| *** [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
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| ** PMMA
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| *** [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
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| *** [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
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| ** AZ resists
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| *** [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
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| *** [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
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| ** ...
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| *Metals/Silicon/Graphene
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| **[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
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| *Glass
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| **[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
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| ** [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
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| **[[Specific Process Knowledge/Back-end processing/Sandblasting|Sandblasting (at DTU Nanotech).]]
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| <BR>
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| == Comparison of equipment/material == | | == Comparison of equipment/material == |
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