Specific Process Knowledge/Thin film deposition: Difference between revisions

MVD - Molecular Vapor Deposition
Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind

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 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
-<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
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 [[/Deposition of Silicon|Silicon]] <br/>
 [[/Deposition of Germanium|Germanium]] <br/>
-[[/DiamondCVD|Diamond]] <br/>
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 *[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
 *[[/Lesker|Lesker]] - ''Sputter tool''
-*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
 *[[/thermalevaporator|Thermal evaporator]]
 *[[/Temescal|E-Beam Evaporator (Temescal)]]
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 *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
-*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''
+<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
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 *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)