Specific Process Knowledge/Thin film deposition/Deposition of Alumina: Difference between revisions
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''All text by Nanolab staff'' | ''All text by Nanolab staff'' | ||
==Deposition of | ==Deposition of Al<sub>2</sub>O<sub>3</sub>== | ||
Aluminium oxide (Alumina, Al<sub>2</sub>O<sub>3</sub>) can be deposited by use of ALD (atomic layer deposition), by e-beam evaporation or by sputtering. During the evaporation or sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample. | Aluminium oxide (Alumina, Al<sub>2</sub>O<sub>3</sub>) can be deposited by use of ALD (atomic layer deposition), by e-beam evaporation or by sputtering. During the evaporation or sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample. | ||
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*[[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]] | *[[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]] | ||
*[[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|Sputter-System Metal-Oxide(PC1)]] | *[[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|Sputter-System Metal-Oxide(PC1)]] | ||
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition of Alumina/E-beam Evaporation of Al2O3 in Temescal-2|Evaporation of Al<sub>2</sub>O<sub>3</sub> in E-Beam Evaporator (10-pockets)]] | |||
==Comparison of the methods for deposition of Alumium Oxide== | ==Comparison of the methods for deposition of Alumium Oxide== |
Latest revision as of 15:31, 7 February 2024
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All text by Nanolab staff
Deposition of Al2O3
Aluminium oxide (Alumina, Al2O3) can be deposited by use of ALD (atomic layer deposition), by e-beam evaporation or by sputtering. During the evaporation or sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample.
- Al2O3 deposition using ALD
- Sputter-System(Lesker)
- Sputter-System Metal-Oxide(PC1)
- Evaporation of Al2O3 in E-Beam Evaporator (10-pockets)
Comparison of the methods for deposition of Alumium Oxide
Sputter-System(Lesker) | Sputter-System Metal-Oxide(PC1) | ALD Picosun 200 | 10-pocket e-beam evaporator | |
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Generel description |
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Stoichiometry |
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Film Thickness |
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Deposition rate |
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Step coverage |
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Process Temperature |
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More info on Al2O3 | ||||
Substrate size |
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Allowed materials |
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