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= Resist coating =
= Resist coating =
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.


We recommend all groups or users to have their own bottle of e-beam resist inside the cleanroom. Please follow the [[Specific Process Knowledge/Lithography/EBeamLithography/ResistBottles|user resist bottles in the cleanroom guide.]]
We recommend all groups or users to have their own bottle of e-beam resist inside the cleanroom. Please follow the [[Specific Process Knowledge/Lithography/EBeamLithography/ResistBottles|user resist bottles in the cleanroom guide.]]


==DTU Nanolab supplied EBL resists==
==DTU Nanolab supplied EBL resists==
 
<br>
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="95%"
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="95%"
|-
|-
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|'''Technical reports'''
|'''Technical reports'''
|'''Spin Coater'''
|'''Spin Coater'''
|'''Polynomial'''
|'''Thinner'''
|'''Thinner'''
|'''Developer'''
|'''Developer'''
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|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-P6200_CSAR62english_Allresist_product-information.pdf AR-P 6200 info]  
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-P6200_CSAR62english_Allresist_product-information.pdf AR-P 6200 info]  
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] or [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] or [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|a = 7252.2, b = -0.454
|Anisole
|Anisole
|
|
*AR-600-546
ZED N50
*AR-600-548
*N50  
*MIBK:IPA
|IPA
|IPA
|
|
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|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf AR-N 8200 info]
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf AR-N 8200 info]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|a = ?, b = ?
|AR 600-07
|AR 600-07
|AR 300-47:DIW (1:1)
|AR 300-47:DIW (1:1)
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''[[Specific_Process_Knowledge/Lithography/ARN7500|AR-N 7500]]'''
|'''[[Specific Process Knowledge/Lithography/EBeamLithography/AR-N 7520 New|AR-N 7520 New]]'''
|Negative
|Negative
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-N7500_english_Allresist_product-information.pdf AR-N 7500 info]
|[[media:AR-N-7520New.pdf‎|AR-N7500New]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|PGMEA
|
*AR 300-47
*MIF 726
|H2O
|
|
 
|-
|-style="background:LightGrey; color:black"
|'''[[Specific Process Knowledge/Lithography/EBeamLithography/AR-P 617|AR-P 617]]'''
|Positive
|[http://www.allresist.com AllResist]
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-P610_english_Allresist_product-information.pdf AR-P 617 info]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|a = 17126, b = -0.435
|PGMEA
|PGMEA
|AR 600-50
|IPA
|Remover 1165
|
|
*AR 300-47:DIW (4:1)
 
*MIF726:DIW (8:5)
|-
|DIW
|-style="background:WhiteSmoke; color:black"
|'''[[Specific Process Knowledge/Lithography/EBeamLithography/ma-N 2400|ma-N 2400]]'''
|Negative
|[https://www.microresist.de/en/produkt/ma-n-2400-series/ Micro Resist Technology]
|
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|Anisole
|
|
*AR 300-73
*MIF 726
*O2 plasma
*ma-D 525
|H2O
|mr-Rem 700
|
|


|}
|}
 
<br>
Resist thickness as function of spin speed on Lab Spin 2/3 can be estimated from the parameters above as y = ax<sup>b</sup>, where y is resist thickness in nm and x is spin speed in RPM.
<br>


==User supplied resists==
==User supplied resists==
It is possible to obtain permission to user other resists at DTU Nanolab, users must however provide these resists and possibly developers themselves. A non-exhaustive list of user supplied EBL resist used at DTU Nanolab and some process guidelines can be found in the table below.
It is possible to obtain permission to user other resists at DTU Nanolab, users must however provide these resists and possibly developers themselves. A non-exhaustive list of user supplied EBL resist used at DTU Nanolab and some process guidelines can be found in the table below.
 
<br>
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="95%"
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="95%"
|-
|-
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''[[Specific_Process_Knowledge/Lithography/ARP617|Copolymer AR-P 617]]'''
|'''[[Specific Process Knowledge/Lithography/EBeamLithography/AR-P 617|Copolymer AR-P 617]]'''
|Positive
|Positive
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
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|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''[[Specific_Process_Knowledge/Lithography/mrEBL6000|mr EBL 6000.1]]'''
|'''mr EBL 6000.1'''
|Negative
|Negative
|[http://http://www.microresist.de/home_en.htm MicroResist]
|[http://http://www.microresist.de/home_en.htm MicroResist]
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|
|
|[[media:Process Flow HSQ.docx|process flow HSQ]]
|[[media:Process Flow HSQ.docx|process flow HSQ]]
[[Specific_Process_Knowledge/Lithography/EBeamLithography/High_resolution_patterning_with_HSQ|High resolution patterning with HSQ]]
 


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''AR-N 7520'''
|'''AR-N 7500 <br> (not "New" Series)'''
|Negative
|Negative
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@dtu.dk Peixiong Shi] for information.
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-N7500_english_Allresist_product-information.pdf AR-N 7500]
|[[media:AR-N7500-7520.pdf‎|AR-N7500-7520]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|a = 17126, b = -0.435
|PGMEA
|PGMEA
|AR 300-47, TMAH
|H2O
|
|
*AR 300-47:DIW (4:1)
*MIF726:DIW (8:5)
|DIW
|
*AR 300-73
*O2 plasma
|
|


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