Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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= Deposition of Cu = | = Deposition of Cu = | ||
Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes. | Copper can be deposited by e-beam evaporation or sputtering at Nanolab. We have also recently developed a process with thermal evaporation (2024). In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes. | ||
==Studies of Cu deposition== | ==Studies of Cu deposition== | ||
[[/Deposition of Copper/Resistive thermal evaporation of Copper|Resistive thermal evaporation of copper]] | |||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest. | [[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest. | ||