Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
| (2 intermediate revisions by 2 users not shown) | |||
| Line 6: | Line 6: | ||
= Deposition of Cu = | = Deposition of Cu = | ||
Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes. | Copper can be deposited by e-beam evaporation or sputtering at Nanolab. We have also recently developed a process with thermal evaporation (2024). In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes. | ||
==Studies of Cu deposition== | |||
[[/Deposition of Copper/Resistive thermal evaporation of Copper|Resistive thermal evaporation of copper]] | |||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest. | |||
[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)'' | |||
==Comparison of equipment for Cu deposition== | |||
{| border="1" cellspacing="0" cellpadding="3" | {| border="1" cellspacing="0" cellpadding="3" | ||
|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
| Line 82: | Line 91: | ||
'''**''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | '''**''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | ||