Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride: Difference between revisions
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The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.: | The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.: | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride/ScN Reactive | * [[Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride/ScN Reactive Sputtering in Cluster Lesker PC3|Deposition of Scandium Nitride (ScN) using reactive sputtering]] in Sputter-System Metal-Nitride(PC3) Source 1 (4-inch target) | ||
At the moment (October 2023) we have a 4-inch Sc target (0.250" thick bonded to Cu) for PC3 Src1. | At the moment (October 2023) we have a 4-inch Sc target (0.250" thick, bonded to Cu) for PC3 Src1. | ||
Latest revision as of 12:56, 9 November 2023
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Deposition of Scandium Nitride
Deposition of ScN can only be done by reactive sputtering using Sc target.
The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:
- Deposition of Scandium Nitride (ScN) using reactive sputtering in Sputter-System Metal-Nitride(PC3) Source 1 (4-inch target)
At the moment (October 2023) we have a 4-inch Sc target (0.250" thick, bonded to Cu) for PC3 Src1.