Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
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'''Feedback to this page: | '''Feedback to this page: | ||
[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]''' | [mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]''' | ||
[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
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==Pegasus 4 - 150mm silicon oxide and silicon nitride etching== | ==Pegasus 4 - 150mm silicon oxide and silicon nitride etching== | ||
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*[[/Barc Etch|Barc Etch]] | *[[/Barc Etch|Barc Etch]] | ||
*[[/SiO2 Etch|SiO2 Etch]] | *[[/SiO2 Etch|SiO2 Etch]] | ||
*[[/Silicon Nitride Etch|Silicon Nitride Etch]] | |||
*[[/Nitride Etch|Nitride etch with SiO2 etch recipes]] | *[[/Nitride Etch|Nitride etch with SiO2 etch recipes]] | ||
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | *[[/Slow etch|Slow etch of silicon nitride and silicon oxide]] | ||