Specific Process Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide click here]''' | |||
Content and illustration by Thomas Pedersen, DTU Nanolab unless otherwise noted. | |||
[[File:TPE02803.jpg|right|400px]] | [[File:TPE02803.jpg|right|400px]] | ||
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*Only authorized users are allowed to use this machine. | *Only authorized users are allowed to use this machine. | ||
*In E-2, all users must keep within the area between the front side of the machine and the table with the pre-aligner setup. Only JEOL staff or DTU Nanolab staff may access the backside of the machine. | *In E-2, all users must keep within the area between the front side of the machine and the table with the pre-aligner setup. Only JEOL staff or DTU Nanolab staff may access the backside of the machine. | ||
*No users, not even authorised users, are allowed to load a | *No users, not even authorised users, are allowed to load a cassette into the automatic cassette transfer system. | ||
*After your exposure, fully trained users can unload their cassettes from the automatic cassette transfer system and unmount their substrates. | *After your exposure, fully trained users can unload their cassettes from the automatic cassette transfer system and unmount their substrates. | ||
*If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates. | *If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates. | ||
*Training can be requested by sending a mail with relevant process flow to training@nanolab.dtu.dk | *Training can be requested by sending a mail with relevant process flow to training@nanolab.dtu.dk | ||
<br> | <br> | ||
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*The spot beam for electron beam writing is generated by a ZrO/W emitter and a four-stage electron beam focusing lens system. | *The spot beam for electron beam writing is generated by a ZrO/W emitter and a four-stage electron beam focusing lens system. | ||
*The maximum frequency of the deflector scanner is | *The maximum frequency of the deflector scanner is 200 MHz, i.e. the minimum beam dwell time is 5 ns. | ||
*The acceleration voltage is locked at 100 kV. | *The acceleration voltage is locked at 100 kV. | ||
*The e-beam writer can pattern structures with a minimum resolution of 10 nm. | *The e-beam writer can pattern structures with a minimum resolution of 10 nm. | ||
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| colspan="2" style="text-align: center;| | | colspan="2" style="text-align: center;| | ||
Operation screen of the automatic cassette transfer system / auto stocker | Operation screen of the automatic cassette transfer system / auto stocker. | ||
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| colspan="2" style="text-align: center;| | | colspan="2" style="text-align: center;| | ||
Samples can be loaded into appropriate cassettes on the cassette preparation table | Samples can be loaded into appropriate cassettes on the cassette preparation table. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Nanolab staff member loading the 4" wafer cassette to the automatic cassette transfer system | Nanolab staff member loading the 4" wafer cassette to the automatic cassette transfer system. | ||
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<br> | <br> | ||
=Cassette transfer= | ==Cassette transfer== | ||
Cassette transfer is controlled from the '''Loader''' program. If it is not open it can be opened from the '''EBX Menu''' by clicking '''Ldr.''' | Cassette transfer is controlled from the '''Loader''' program. If it is not open it can be opened from the '''EBX Menu''' by clicking '''Ldr.''' | ||
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<br> | <br> | ||
=System calibration= | ==System calibration== | ||
After cassette transfer the system has to be calibrated with the chosen beam current condition profile. This is done in a mostly automated sequence with only minute input from the user. The sequence is explained in detail in the following but in overview it is | After cassette transfer the system has to be calibrated with the chosen beam current condition profile. This is done in a mostly automated sequence with only minute input from the user. The sequence is explained in detail in the following but in overview it is | ||
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*Execute pattern writing | *Execute pattern writing | ||
==Select and restore the system to the chosen beam current profile== | ===Select and restore the system to the chosen beam current profile=== | ||
The SDF specifies which system condition file to use for the exposure, this determines the beam current. Condition files are named according to beam current and beam aperture, for instance '''6nA_ap5''' which will expose at 6 nA using aperture 5. Restoring a condition file for use is done from the '''Calibration''' window, if it is not open it can be opened from the '''EBX Menu'''. | The SDF specifies which system condition file to use for the exposure, this determines the beam current. Condition files are named according to beam current and beam aperture, for instance '''6nA_ap5''' which will expose at 6 nA using aperture 5. Restoring a condition file for use is done from the '''Calibration''' window, if it is not open it can be opened from the '''EBX Menu'''. | ||
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| colspan="2" style="text-align:center;| | | colspan="2" style="text-align:center;| | ||
'''Calibration''' and '''RESTOR''' windows | '''Calibration''' and '''RESTOR''' windows. | ||
|} | |} | ||
==System self calibration== | ===System self calibration=== | ||
With the correct condition file restored the next step is to measure beam current and verify that it is close to the expected value. | With the correct condition file restored the next step is to measure beam current and verify that it is close to the expected value. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Result display of current measurement | Result display of current measurement. | ||
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| colspan="2" style="text-align:center;| | | colspan="2" style="text-align:center;| | ||
Correct result of '''INITAE''' (left) and '''INITBE''' (right) | Correct result of '''INITAE''' (left) and '''INITBE''' (right). | ||
|} | |} | ||
Correct execution will look like above. '''INITAE''' uses the beam to scan a PN-junction which the system uses to determine beam position and shape. '''INITBE''' uses the beam to scan a gold marker on the stage which the system uses for position and distortion correction of the beam placement within the writing field. The top row shows the signal, the following rows shows the 1st and 2nd derivative, respectively. | Correct execution will look like above. '''INITAE''' uses the beam to scan a PN-junction which the system uses to determine beam position and shape. '''INITBE''' uses the beam to scan a gold marker on the stage which the system uses for position and distortion correction of the beam placement within the writing field. The top row shows the signal, the following rows shows the 1st and 2nd derivative, respectively. | ||
== Auto calibration == | === Auto calibration === | ||
The system can auto calibrate itself using the AE and BE stage marks. The system will automatically measure beam position at various locations of the writing field to determine position errors. A correction matrix will be applied and the beam position will be remeasured to validate the result. The sequence takes about 8 minutes to execute. This should be done every time beam current is changed, i.e. a new condition file is restored. The procedure is | The system can auto calibrate itself using the AE and BE stage marks. The system will automatically measure beam position at various locations of the writing field to determine position errors. A correction matrix will be applied and the beam position will be remeasured to validate the result. The sequence takes about 8 minutes to execute. This should be done every time beam current is changed, i.e. a new condition file is restored. The procedure is | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Load the '''daily''' batch command and execute it | Load the '''daily''' batch command and execute it. | ||
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==Measure stage drift== | ===Measure stage drift=== | ||
The next step is to measure stage drift. This is done from the '''Calibration''' window. | The next step is to measure stage drift. This is done from the '''Calibration''' window. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Comparison of two drift measurements | Comparison of two drift measurements. | ||
|} | |} | ||
In this example the two drift measurements are made a bit more than 1 minute apart (look at timestamps). The x-axis drift has changed from 65.4 nm to 64.2 nm, i.e. a change of 1.2 nm in about 1 minute. The y-axis drift has changed from 85.3 nm to 86.8 nm, a shift of 1.5 nm in about 1 minute. Thus the drift is about 1-1.5 nm/min in this particular example. This is a typical value. If you experience drift of 5-10 nm/min, give the system 10 min to thermally equilibrate and try again. If drift is above 10 nm/min please call the e-beam personnel for assistance. | In this example the two drift measurements are made a bit more than 1 minute apart (look at timestamps). The x-axis drift has changed from 65.4 nm to 64.2 nm, i.e. a change of 1.2 nm in about 1 minute. The y-axis drift has changed from 85.3 nm to 86.8 nm, a shift of 1.5 nm in about 1 minute. Thus the drift is about 1-1.5 nm/min in this particular example. This is a typical value. If you experience drift of 5-10 nm/min, give the system 10 min to thermally equilibrate and try again. If drift is above 10 nm/min please call the e-beam personnel for assistance. | ||
==Measure height profile of sample== | ===Measure height profile of sample=== | ||
The height of the sample surface must be known to focus the electron beam properly at the surface. This can be done using the '''HEIMAP''' subprogram. | The height of the sample surface must be known to focus the electron beam properly at the surface. This can be done using the '''HEIMAP''' subprogram. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Parameter window of the '''HEIMAP''' subprogram | Parameter window of the '''HEIMAP''' subprogram. | ||
|} | |} | ||
The example above will create a 3x3 matrix of height data with a pitch of 1 mm in x and y. After execution the system will display a matrix with height measurement data in µm. Verify that there are no outliers and that variation is less than 100 µm from top to bottom. | The example above will create a 3x3 matrix of height data with a pitch of 1 mm in x and y. After execution the system will display a matrix with height measurement data in µm. Verify that there are no outliers and that variation is less than 100 µm from top to bottom. | ||
==Save condition file== | ===Save condition file=== | ||
For the calibration data to have effect during exposure the data must be saved into the calibration profile. This is done via the '''SAVE''' subprogram from the '''Calibration''' window. | For the calibration data to have effect during exposure the data must be saved into the calibration profile. This is done via the '''SAVE''' subprogram from the '''Calibration''' window. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
Acquire the calibration data and then apply the data to save | Acquire the calibration data and then apply the data to save. | ||
|} | |} | ||
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All of the calibration data is now saved and the system is ready for exposure. | All of the calibration data is now saved and the system is ready for exposure. | ||
==Job execution== | ===Job execution=== | ||
The job and the system is now ready to execute the exposure. | The job and the system is now ready to execute the exposure. | ||
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| colspan="1" style="text-align:center;| | | colspan="1" style="text-align:center;| | ||
'''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started | '''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started. | ||
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<br> | <br> | ||
=Job execution with alignment= | |||
Execution of jobs that require alignment requires a few additional steps compared to the process described above. The additional steps are: | |||
*Optical prealignment of the mounted substrate to determine PQ mark offsets and substrate rotation | |||
*Gain correction to ensure the backscatter detector provides sufficient signal for mark detection using '''AGCRG''' | |||
*Verification of PQ mark detection using '''SETWFR''' | |||
*Verification of chip mark detection using '''CHIPAL''' if chip marks are used | |||